公开(公告)号：US20240200262A1

公开(公告)日：2024-06-20

申请号：US18286559

申请日：2022-03-04

Applicant: airweave inc.

Inventor： Akira MIZUNO

IPC: D06M23/14 ,  D06M13/53

CPC classification number: D06M23/14 ,  D06M13/53 ,  D06M2200/40

Abstract: A cut surface smoothing device which can smooth the cut surface of a filament three-dimensional bonded member is provided. The cut surface smoothing device includes a high temperature portion which is heated to a temperature equal to or higher than the melting point of the filament three-dimensional bonded member, and the high temperature portion is applied to the cut surface of the filament three-dimensional bonded member to smooth the cut surface.

公开(公告)号：US20240008664A1

公开(公告)日：2024-01-11

申请号：US18035110

申请日：2021-10-13

Applicant: airweave inc.

Inventor： Akira MIZUNO ,  Yusuke HAYASHI

IPC: A47G9/10 ,  D04H3/16 ,  D04H3/018

CPC classification number: A47G9/1081 ,  D04H3/16 ,  D04H3/018

Abstract: A cushion member is provided which can stabilize a head position while sinking a head moderately. The cushion member is a cushion member for a pillow which is formed using a filament three-dimensional bonded member obtained by three-dimensionally fusing filaments formed of a thermoplastic resin, in a width direction, repulsive forces in regions on the sides of both end portions are higher than a repulsive force in the region of a center portion and in a depth direction, repulsive forces in regions on the sides of both end portions are higher than a repulsive force in the region of a center portion.

公开(公告)号：US20180147792A1

公开(公告)日：2018-05-31

申请号：US15578243

申请日：2016-09-14

Applicant: airweave inc.

Inventor： Masakazu KOJIMA ,  Masashi FUCHIGAMI ,  Narutaka MAKINO ,  Akira MIZUNO

IPC: B29C70/24 ,  D04H3/037 ,  D04H3/14

CPC classification number: B29C70/24 ,  B29C64/118 ,  B29K2101/12 ,  B33Y40/00 ,  B33Y70/00 ,  D04H3/03 ,  D04H3/037 ,  D04H3/14 ,  D04H3/16

Abstract: In a device for manufacturing a filament three-dimensional bonded member includes: a molten filament supply device which supplies a plurality of molten filaments; a three-dimensional structure formation device which receives and then cools and solidifies the molten filaments so as to form a filament three-dimensional bonded member; and a controller which controls the molten filament supply device and the three-dimensional structure formation device, a hardness index measurement device is provided which measures the hardness index of the filament three-dimensional bonded member that is brought into a cooled state by the three-dimensional structure formation device, and the controller uses the information of the measurement of the hardness index measurement device that is fed back and thereby performs feedback control on at least one of the molten filament supply device and the three-dimensional structure formation device so as to reduce a variation in the hardness of the formed filament three-dimensional bonded member.