公开(公告)号：US20220317391A1

公开(公告)日：2022-10-06

申请号：US17640185

申请日：2020-08-25

Applicant: ams AG

Inventor： Jochen Kraft ,  Bernhard Stering ,  Colin Steele ,  Jean Francois Seurin

IPC: G02B6/42

Abstract: A bonded structure comprises a substrate component having a plurality of first pads arranged on or within a surface of the substrate component, and an integrated circuit component having a plurality of second pads arranged on or within a surface of the integrated circuit component. The bonded structure further comprises a plurality of connection elements physically connecting the first pads to the second pads. The surface of the integrated circuit component is tilted obliquely to the surface of the substrate component at a tilt angle that results from nominal variations of surface sizes of the first and second pads.