公开(公告)号：US20250030219A1

公开(公告)日：2025-01-23

申请号：US18713811

申请日：2022-11-28

Applicant: ams-OSRAM International GmbH

Inventor： Tobias HAUPELTSHOFER ,  Markus Reinhard HORN ,  Christoph WALTER

IPC: H01S5/0233 ,  H01S5/0239 ,  H01S5/40

Abstract: The invention relates to a laser component including a first laser chip with a first emission region, a second laser chip with a second emission region, and a connection carrier with an upper side and an underside, wherein the first laser chip is secured to the upper side of the connection carrier and is electrically connected, the second laser chip is secured to the underside of the connection carrier and is electrically connected, and the connection carrier has a thickness of max. 200 μm.