公开(公告)号：US20230170667A1

公开(公告)日：2023-06-01

申请号：US17920160

申请日：2021-04-20

Applicant: ams-OSRAM International GmbH

Inventor： Markus Reinhard HORN ,  Jörg Erich SORG ,  Harald KÖNIG

IPC: H01S5/0237 ,  H01S5/40 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/024

CPC classification number: H01S5/0237 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/02492 ,  H01S5/4031 ,  H01S5/4093

Abstract: The invention relates to a method for producing a semi-conductor laser arrangement, in which a first laser diode chip is arranged on a first intermediate support. A second laser diode chip is arranged on a second intermediate support. The second laser diode chip with the second intermediate support is arranged on the first intermediate support, the second intermediate support being arranged on a side of the second laser diode chip facing away from the first intermediate support. The invention furthermore relates to a semi-conductor arrangement.

公开(公告)号：US20250030219A1

公开(公告)日：2025-01-23

申请号：US18713811

申请日：2022-11-28

Applicant: ams-OSRAM International GmbH

Inventor： Tobias HAUPELTSHOFER ,  Markus Reinhard HORN ,  Christoph WALTER

IPC: H01S5/0233 ,  H01S5/0239 ,  H01S5/40

Abstract: The invention relates to a laser component including a first laser chip with a first emission region, a second laser chip with a second emission region, and a connection carrier with an upper side and an underside, wherein the first laser chip is secured to the upper side of the connection carrier and is electrically connected, the second laser chip is secured to the underside of the connection carrier and is electrically connected, and the connection carrier has a thickness of max. 200 μm.

公开(公告)号：US20230253754A1

公开(公告)日：2023-08-10

申请号：US18004498

申请日：2021-07-07

Applicant: ams-OSRAM International GmbH

Inventor： Jörg Erich SORG ,  Markus Reinhard HORN ,  Jan SEIDENFADEN ,  Harald KÖNIG

IPC: H01S5/02235

CPC classification number: H01S5/02235 ,  H01S5/02255

Abstract: The invention relates to a laser device which includes at least one laser diode having an emission surface via which the laser diode can emit laser light during operation, and a screening element having an entry surface facing the emission surface.