SEALING DEVICE AND METHOD USEFUL IN SEMICONDUCTOR PROCESSING APPARATUS FOR BRIDGING MATERIALS HAVING A THERMAL EXPANSION DIFFERENTIAL
    1.
    发明申请
    SEALING DEVICE AND METHOD USEFUL IN SEMICONDUCTOR PROCESSING APPARATUS FOR BRIDGING MATERIALS HAVING A THERMAL EXPANSION DIFFERENTIAL 无效
    密封装置和方法在半导体加工装置中用于桥接具有热膨胀的材料差异

    公开(公告)号:US20010040029A1

    公开(公告)日:2001-11-15

    申请号:US08964260

    申请日:1997-11-04

    Abstract: Apparatus for promoting heat transfer between a first volume (chamber volume) and a second volume (expandable, substrate support platform volume). Specifically, the apparatus comprises: a chamber defining a chamber volume that contains a chamber atmosphere, e.g., a partial vacuum; a substrate support platform that defines an expandable volume that contains a heat transfer medium, e.g., air; and a seal that isolates the chamber volume from the heat transfer medium. The substrate support platform further comprises: a substrate support platen that has a first surface located within the chamber volume and a second surface located within the expandable volume; a housing sealed to the second surface of the substrate support platen; and a expandable member such as a bellows, attached to the housing, to provide for expansion of the expandable volume that is defined by the housing and the bellows. The housing is typically fabricated of metal and the substrate support is typically fabricated of ceramic. The seal forms a hermetic junction between the ceramic substrate support and the metal housing.

    Abstract translation: 用于促进第一容积(室容积)和第二容积(可扩展的衬底支撑平台体积)之间的热传递的装置。 具体地说,该装置包括:限定腔室容积的室,其容纳室气氛,例如部分真空; 衬底支撑平台,其限定包含传热介质例如空气的可膨胀体积; 以及隔离室体积与传热介质的密封。 衬底支撑平台还包括:衬底支撑压板,其具有位于腔体内的第一表面和位于可膨胀体积内的第二表面; 密封到所述基板支撑台板的第二表面的壳体; 以及附接到壳体的可膨胀构件,例如波纹管,以提供由壳体和波纹管限定的可膨胀体积的膨胀。 壳体通常由金属制成,并且衬底支撑件通常由陶瓷制成。 密封件在陶瓷基板支撑件和金属外壳之间形成密封接合部。

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