公开(公告)号：US20170027065A1

公开(公告)日：2017-01-26

申请号：US15130167

申请日：2016-04-15

Applicant: eSionic Corp.

Inventor： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

IPC: H05K3/38 ,  H05K1/09

CPC classification number: H05K3/385 ,  H05K1/09 ,  H05K3/389 ,  H05K3/4652 ,  H05K2203/1157 ,  Y10T156/10

Abstract: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

Abstract translation: 本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。 更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。 经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。