Method and apparatus for chemical mechanical polishing
    91.
    发明授权
    Method and apparatus for chemical mechanical polishing 失效
    化学机械抛光方法和装置

    公开(公告)号:US07785175B2

    公开(公告)日:2010-08-31

    申请号:US11133195

    申请日:2005-05-20

    IPC分类号: B24B1/00

    CPC分类号: B24B37/046 B24B37/042

    摘要: A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a wafer and a polishing pad to polish the wafer with an electrolytic effect. The polishing device has the atmosphere containing extremely less oxygen, preventing a surface of the wafer from oxidation and thereby providing a constant polishing rate.

    摘要翻译: 抛光装置气密地容纳在包含具有不同于周围空气的组成的气氛的室中,使得抛光装置周围的气氛被改变成与环境空气不同的组成,并且在晶片和抛光之间施加电压 垫片以电解效果抛光晶片。 抛光装置具有含有极少氧的气氛,防止晶片的表面氧化,从而提供恒定的抛光速率。

    Wafer polishing apparatus and wafer polishing method
    92.
    发明授权
    Wafer polishing apparatus and wafer polishing method 失效
    晶圆抛光装置和晶圆抛光方法

    公开(公告)号:US07753761B2

    公开(公告)日:2010-07-13

    申请号:US11560952

    申请日:2006-11-17

    申请人: Takashi Fujita

    发明人: Takashi Fujita

    IPC分类号: B24B1/00

    CPC分类号: B24B37/04 B24B57/02

    摘要: The present invention provides a wafer polishing apparatus, comprising: a polishing pad to which a polishing liquid is supplied for polishing a wafer; a carrier head to carry the wafer; and one or more polishing liquid supplying device which supplies the polishing liquid onto the polishing pad, wherein the polishing liquid supplying device has a polishing liquid supplying member which is positioned close to or in contact with the polishing pad, and is relatively moved against the polishing pad, so that the polishing liquid supplied to the upper portion of the polishing liquid supplying member flows down along the polishing liquid supplying member to be painted on a surface of the polishing pad.

    摘要翻译: 本发明提供了一种晶片抛光装置,包括:抛光垫,抛光液体被供给到抛光液晶片; 载体头承载晶片; 以及一个或多个抛光液体供应装置,其将研磨液供给到抛光垫上,其中抛光液供给装置具有与抛光垫接近或接触的抛光液供给部件,并相对于抛光而相对移动 衬垫,使得供给到抛光液供给部件的上部的研磨液沿着研磨液供给部件向下流动,涂布在研磨垫的表面上。

    Image data processing method and apparatus, storage medium product, and program product
    93.
    发明授权
    Image data processing method and apparatus, storage medium product, and program product 失效
    图像数据处理方法和装置,存储介质产品和程序产品

    公开(公告)号:US07750921B2

    公开(公告)日:2010-07-06

    申请号:US11372015

    申请日:2006-03-10

    IPC分类号: G09G5/02 G09G5/00

    CPC分类号: H04N1/6005 H04N1/6058

    摘要: When printing image data obtained by an input device, the present invention is intended to effectively utilize the color reproduction area of the printer. An image data processing method of the present invention comprises the steps of scale-down shifting a first color space point outside a maximum color reproduction area of an output unit to a second color space point within the maximum color reproduction area of the output unit; computing an amount of shift by which the first color space point is shifted to the second color space point; converting the second color space point to a third color space point within a color reproduction area smaller than the maximum color reproduction area of the output unit; and outputting an image to the output unit using image data obtained by scale-up shifting the third color space point to a fourth color space point within the maximum color reproduction area of the output unit based on the computed shift amount.

    摘要翻译: 当打印由输入装置获得的图像数据时,本发明旨在有效地利用打印机的色彩再现区域。 本发明的图像数据处理方法包括以下步骤:将输出单元的最大色彩再现区域之外的第一色彩空间点向下移位到输出单元的最大色彩再现区域内的第二色彩空间点; 计算第一颜色空间点移动到第二颜色空间点的偏移量; 将所述第二颜色空间点转换为比所述输出单元的最大颜色再现区域小的颜色再现区域内的第三颜色空间点; 并且使用通过基于所计算的移位量将所述第三颜色空间点向所述输出单元的最大颜色再现区域内的第四颜色空间点进行放大而将所获得的图像数据输出到所述输出单元。

    Image forming apparatus
    95.
    发明授权
    Image forming apparatus 失效
    图像形成装置

    公开(公告)号:US07711300B2

    公开(公告)日:2010-05-04

    申请号:US11857579

    申请日:2007-09-19

    IPC分类号: G03G15/20

    CPC分类号: G03G15/24 G03G2215/1695

    摘要: An image forming apparatus includes an image carrier for bearing a visible image thereon, an endless transfer-fixing belt stretchedly disposed between a plurality of spanning members, a pressure member for pressing the transfer-fixing belt to the image carrier while contacting a backside of the transfer-fixing belt at the transfer nip, and a heater for heating the visible image. The visible image on the image carrier is transferred onto the front surface of the transfer-fixing belt at the transfer nip and is transported to the transfer-fixing nip while heated by the heater, where the visible image is transferred and fixed on a recording member. The transfer-fixing belt is stretchedly arranged such that the transfer-fixing belt travels in a direction substantially perpendicular to a pressure direction of the pressure member in the proximity of the transfer nip.

    摘要翻译: 图像形成装置包括用于在其上承载可见图像的图像载体,张紧地设置在多个跨越构件之间的环形转印定影带,用于将转印固定带按压到图像载体的压力构件,同时接触 在转印辊隙处的转印定影带,以及用于加热可见图像的加热器。 图像载体上的可见图像在转印辊隙处转印到转印固定带的前表面上,并且在可见图像被转印并固定在记录元件上的同时被加热器传送到转印定影辊隙 。 转印定影带被拉伸布置成使得转印定影带在与转印辊隙附近的压力构件的压力方向基本上垂直的方向上行进。

    Pad conditioner, pad conditioning method, and polishing apparatus
    96.
    发明授权
    Pad conditioner, pad conditioning method, and polishing apparatus 有权
    垫调节剂,垫调理方法和抛光装置

    公开(公告)号:US07670209B2

    公开(公告)日:2010-03-02

    申请号:US11463209

    申请日:2006-08-08

    申请人: Takashi Fujita

    发明人: Takashi Fujita

    IPC分类号: B24B55/10

    CPC分类号: B24B53/017 B24D13/10

    摘要: The present invention provides a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising: a substrate disposed opposite to the polishing pad; a plurality of pellets removably attached to the substrate; and a plurality of linear elastic members which have tip ends and are implanted into the pellets, wherein upon contact of the tip ends of the linear elastic members with the polishing pad, the linear elastic members elastically deform, so that a pressure necessary for conditioning the pad is generated in order to maintain a change in conditioning capability within a predetermined range and have a wide margin for adjusting a height of the conditioner.

    摘要翻译: 本发明提供一种用于修整用于抛光工件的抛光装置中的抛光垫的表面的垫调节器,包括:与抛光垫相对设置的基板; 多个可拆卸地附接到所述基板的小球; 以及多个线状弹性构件,其具有尖端并且被注入到所述颗粒中,其中当所述线性弹性构件的所述末端与所述抛光垫接触时,所述线性弹性构件弹性变形,使得调节所述 生成垫以便将调节能力的变化保持在预定范围内并且具有用于调节调节器的高度的宽裕度。

    Polishing method and polishing apparatus
    97.
    发明授权
    Polishing method and polishing apparatus 失效
    抛光方法和抛光装置

    公开(公告)号:US07632169B2

    公开(公告)日:2009-12-15

    申请号:US11807069

    申请日:2007-05-25

    申请人: Takashi Fujita

    发明人: Takashi Fujita

    IPC分类号: B24B1/00

    CPC分类号: B24B37/04 B24B57/02

    摘要: An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce scratches due to the polishing by-product, and can suppress consumption of slurry to the minimum to realize cost reduction during running for mass production.In order to achieve the above object, the present invention provides a polishing method where a mechanism that suspends a member 15a on a pad 19 surface to bring the member in contact with or cause the member to approach the pad 19 surface and supplies the slurry along the member 15a to apply the slurry to the pad 19 surface is provided, a surface of the pad 19 applied for polishing has a plurality of grooves communicating from a central portion of a surface portion of the pad to an edge portion thereof, and a step of supplying pure water along the respective grooves during a polishing processing to remove polishing by-product from the edge portion to the outside of the pad 19 is provided.

    摘要翻译: 本发明的目的是提供一种抛光方法和抛光装置,其可以确保均匀抛光的形状,并且可以有效地去除有助于抛光的浆料并且将抛光副产物有效地抛光到垫的外部,以减少由于 抛光副产物,可以将浆料的消耗降至最低,实现批量生产运行中的成本降低。 为了实现上述目的,本发明提供了一种抛光方法,其中,将构件15a悬挂在垫19表面上以使构件与构件接触或使构件接近衬垫19表面并将浆料沿着 提供了将浆料施加到垫19表面的构件15a,用于抛光的衬垫19的表面具有从衬垫的表面部分的中心部分到其边缘部分的多个沟槽,并且步骤 提供了在抛光处理期间沿着各个槽供应纯水以从抛光垫19的边缘部分向外部除去抛光副产物。

    Article Storage Facility
    99.
    发明申请
    Article Storage Facility 有权
    文章存储设施

    公开(公告)号:US20090028675A1

    公开(公告)日:2009-01-29

    申请号:US12178096

    申请日:2008-07-23

    IPC分类号: B65G1/127

    CPC分类号: B65G1/0407 Y10S414/14

    摘要: An article storage facility comprising a storage rack that includes a plurality of storage units that store articles; a first article transport that includes a first vertically movable body guided by a first vertical guide and a first transit body configured to move along a path defined along the storage rack, the first vertical guide being provided in said first article transport so as to be positioned on one side of a lateral direction of the path; and a second article transport that includes a second vertically movable body guided by a second vertical guide and a second transit body configured to move along the path, the second vertical guide being provided in the second article transport so as to be positioned on the other lateral side of the path. The first transit body and said second transit body are configured so as to be able to pass each other.

    摘要翻译: 一种物品存储设备,包括:存储架,其包括存储物品的多个存储单元; 包括由第一垂直引导件引导的第一垂直移动体和构造成沿着沿着所述存储齿条限定的路径移动的第一转移体的第一物品输送件,所述第一竖直引导件设置在所述第一物品输送器中以便定位 在路径的横向方向的一侧; 以及第二物品输送器,其包括由第二垂直引导件引导的第二垂直移动体和被构造成沿着所述路径移动的第二输送体,所述第二垂直引导件设置在所述第二物品输送器中,以便定位在另一侧面 一边的路径。 第一运输车体和所述第二运输车体构造成能够相互通过。

    Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof
    100.
    发明申请
    Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof 有权
    抛光终点预测与检测方法及其装置及实时膜厚监测方法及其装置

    公开(公告)号:US20080290865A1

    公开(公告)日:2008-11-27

    申请号:US11975195

    申请日:2007-10-18

    IPC分类号: G01B7/06

    摘要: An object of the present invention is to provide a method of forecasting and detecting a polishing endpoint and the device thereof and a real time film thickness monitoring method and the device thereof capable of suppressing a Joule heat loss to the minimum due to an eddy current, and precisely forecasting and detecting the polishing endpoint, and moreover, precisely calculating a remaining film amount to be removed and a polishing rate and the like on the spot so as to be able to accurately evaluate whether the predetermined conductive film is appropriately removed.To achieve the above described object, the present invention brings an inductor in a high frequency inductor type sensor close to the predetermined conductive film, and monitors a flux change induced in the predetermined conductive film by the flux formed by the inductor 36, and based on a flux change when a film thickness during the polishing becomes a film thickness corresponding to a skin depth decided with the material of the predetermined conductive film as a factor, detects a film thickness reference point, and forecasts the polishing endpoint from this film thickness reference point, and provides a method of calculating on the spot a polishing rate and a remaining film amount to be removed.

    摘要翻译: 本发明的目的是提供一种预测和检测抛光终点及其装置的方法及其实时膜厚监测方法及其能够由于涡电流而将焦耳热损失抑制到最小的装置, 精确地预测和检测抛光终点,并且还准确地计算待去除的剩余膜量和现场抛光速率等,以便能够准确地评估预定导电膜是否被适当地去除。 为了实现上述目的,本发明使电感器在靠近预定导电膜的高频电感器型传感器中带动,并且通过由电感器36形成的磁通来监测在预定导电膜中感应的磁通量变化,并且基于 当抛光期间的膜厚度变为与由预定导电膜的材料确定的皮肤深度相对应的皮肤深度的膜厚度时的通量变化,检测膜厚度参考点,并且从该膜厚参考点预测抛光终点 ,并且提供一种现场计算要除去的抛光速率和剩余膜量的方法。