摘要:
A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a wafer and a polishing pad to polish the wafer with an electrolytic effect. The polishing device has the atmosphere containing extremely less oxygen, preventing a surface of the wafer from oxidation and thereby providing a constant polishing rate.
摘要:
The present invention provides a wafer polishing apparatus, comprising: a polishing pad to which a polishing liquid is supplied for polishing a wafer; a carrier head to carry the wafer; and one or more polishing liquid supplying device which supplies the polishing liquid onto the polishing pad, wherein the polishing liquid supplying device has a polishing liquid supplying member which is positioned close to or in contact with the polishing pad, and is relatively moved against the polishing pad, so that the polishing liquid supplied to the upper portion of the polishing liquid supplying member flows down along the polishing liquid supplying member to be painted on a surface of the polishing pad.
摘要:
When printing image data obtained by an input device, the present invention is intended to effectively utilize the color reproduction area of the printer. An image data processing method of the present invention comprises the steps of scale-down shifting a first color space point outside a maximum color reproduction area of an output unit to a second color space point within the maximum color reproduction area of the output unit; computing an amount of shift by which the first color space point is shifted to the second color space point; converting the second color space point to a third color space point within a color reproduction area smaller than the maximum color reproduction area of the output unit; and outputting an image to the output unit using image data obtained by scale-up shifting the third color space point to a fourth color space point within the maximum color reproduction area of the output unit based on the computed shift amount.
摘要:
An image forming apparatus includes an image carrier for bearing a visible image thereon, an endless transfer-fixing belt stretchedly disposed between a plurality of spanning members, a pressure member for pressing the transfer-fixing belt to the image carrier while contacting a backside of the transfer-fixing belt at the transfer nip, and a heater for heating the visible image. The visible image on the image carrier is transferred onto the front surface of the transfer-fixing belt at the transfer nip and is transported to the transfer-fixing nip while heated by the heater, where the visible image is transferred and fixed on a recording member. The transfer-fixing belt is stretchedly arranged such that the transfer-fixing belt travels in a direction substantially perpendicular to a pressure direction of the pressure member in the proximity of the transfer nip.
摘要:
The present invention provides a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising: a substrate disposed opposite to the polishing pad; a plurality of pellets removably attached to the substrate; and a plurality of linear elastic members which have tip ends and are implanted into the pellets, wherein upon contact of the tip ends of the linear elastic members with the polishing pad, the linear elastic members elastically deform, so that a pressure necessary for conditioning the pad is generated in order to maintain a change in conditioning capability within a predetermined range and have a wide margin for adjusting a height of the conditioner.
摘要:
An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce scratches due to the polishing by-product, and can suppress consumption of slurry to the minimum to realize cost reduction during running for mass production.In order to achieve the above object, the present invention provides a polishing method where a mechanism that suspends a member 15a on a pad 19 surface to bring the member in contact with or cause the member to approach the pad 19 surface and supplies the slurry along the member 15a to apply the slurry to the pad 19 surface is provided, a surface of the pad 19 applied for polishing has a plurality of grooves communicating from a central portion of a surface portion of the pad to an edge portion thereof, and a step of supplying pure water along the respective grooves during a polishing processing to remove polishing by-product from the edge portion to the outside of the pad 19 is provided.
摘要:
In an image processing apparatus which can always provide an excellent processed image, an analysis unit analyzes condition information representing a condition at a time when an image is obtained and being included in image information, and determines an algorithm of an image correction process for the image based on the analyzed result.
摘要:
An article storage facility comprising a storage rack that includes a plurality of storage units that store articles; a first article transport that includes a first vertically movable body guided by a first vertical guide and a first transit body configured to move along a path defined along the storage rack, the first vertical guide being provided in said first article transport so as to be positioned on one side of a lateral direction of the path; and a second article transport that includes a second vertically movable body guided by a second vertical guide and a second transit body configured to move along the path, the second vertical guide being provided in the second article transport so as to be positioned on the other lateral side of the path. The first transit body and said second transit body are configured so as to be able to pass each other.
摘要:
An object of the present invention is to provide a method of forecasting and detecting a polishing endpoint and the device thereof and a real time film thickness monitoring method and the device thereof capable of suppressing a Joule heat loss to the minimum due to an eddy current, and precisely forecasting and detecting the polishing endpoint, and moreover, precisely calculating a remaining film amount to be removed and a polishing rate and the like on the spot so as to be able to accurately evaluate whether the predetermined conductive film is appropriately removed.To achieve the above described object, the present invention brings an inductor in a high frequency inductor type sensor close to the predetermined conductive film, and monitors a flux change induced in the predetermined conductive film by the flux formed by the inductor 36, and based on a flux change when a film thickness during the polishing becomes a film thickness corresponding to a skin depth decided with the material of the predetermined conductive film as a factor, detects a film thickness reference point, and forecasts the polishing endpoint from this film thickness reference point, and provides a method of calculating on the spot a polishing rate and a remaining film amount to be removed.