摘要:
In one embodiment of the invention, a grating structure etched on a mirror substrate has a grating period causing diffracting, out of an optical path, a first incident radiation within a first band around a first wavelength. A multi-layer coating deposited on the grating structure reflects the first incident radiation, in the optical path, within the first band and a second incident radiation within a second band around a second wavelength. In another embodiment, a first multi-layer coating deposited on a mirror substrate reflects a first incident radiation within a first band around a first wavelength and a second incident radiation, in an optical path, within a second band around a second wavelength. A grating structure is deposited on the first multi-layer coating. The grating structure is etched to have a grating period causing diffracting, out of the optical path, the second incident radiation within the second band.
摘要:
The invention provides a device for securing the upper terminal position of a liftable and lowerable object, comprising cable means having a hoist-side end and an object-side end; a stationary bracket having an aperture disposed in a substantially horizontal plane; a housing supported by the object-side end of the cable means and carrying the object, the housing having a lower portion and an upper portion, at least the upper portion being configured to pass through the aperture, a first opening at the top of the upper portion and a second opening at the bottom of the lower portion facilitating the passage of the cable means through the housing, and two oppositely located, elongated slots extending along at least parts of the upper portion; lever means located inside, and extending through a substantial portion of, the housing, the lever means being pivotably mounted in the lower portion of the housing and being provided with catch means and camming means, the lever means having a first limit position in which the camming means protrudes through one of the elongated slots, and a second limit position in which said catch means protrudes through the other one of the elongated slots, and spring means adapted to act on the lever means and biasing the lever means towards the second limit position.
摘要:
A method for inspecting a surface of a printing medium, the method comprising the steps of acquiring an image of the surface or a portion thereof, digitizing the acquired image whereby a digitized real representation of the surface or portion is obtained. The method also include the step of for each of said digitized real representation performing either or both of the steps of comparing said digitized real representation with a digital reference representation, said reference representation being a virtual digital fault-free representation of said surface or portion thereof and determining whether said real digitized representation is in compliance with stipulations of a set of rules which define the characteristics of a fault-free digital representation of said surface or portion, and providing either a correct indication output signal where there is a match between said real digitized representation with said reference digital representation in the case of the step of comparing or compliance with said rules in the case of said step of determining, or fault indication output signal where there is a mismatch in the case of the step of comparing or incompliance in the case of the case of determining.
摘要:
A silicon/silicon carbide material which eliminates contamination by outgassing and direct contact is described as well as wafer processing pans made of this material and wafer processing methods using the silicon/silicon carbide material. An ultraclean silicon/silicon carbide material may be formed by first forming a Si/SiC part by prior art methods. The Si/SiC part then is subjected to a temperature sufficient to cause the impurities within the silicon carbide to either react and/or diffuse into the silicon fill. The contaminated silicon fill is then removed, either by high temperature evaporation or by a chemical etch. Clean silicon is then impregnated within the pore space of the silicon carbide pan. The part which results has ultraclean silicon and silicon carbide grains which have most, if not all, of the impurities removed from the surface of the grains. Thus, an ultraclean material results which will not outgas or directly contaminate silicon wafers.