OPTICAL ELEMENT, IN PARTICULAR FOR REFLECTING EUV RADIATION, OPTICAL ARRANGEMENT, AND METHOD FOR MANUFACTURING AN OPTICAL ELEMENT

    公开(公告)号:US20230266673A1

    公开(公告)日:2023-08-24

    申请号:US18309809

    申请日:2023-04-30

    发明人: Vitaliy SHKLOVER

    IPC分类号: G03F7/20

    摘要: A reflective optical element (17), in particular for reflecting EUV radiation (16), includes: a substrate (25), and a reflective coating (26) applied to the substrate (25). In one disclosed aspect, the substrate (25) is doped within its volume (V) with at least one precious metal (27). In a further disclosed aspect, the reflective coating (26) and/or a structured layer (28) that is formed between the substrate (25) and the reflective coating (26) is doped with at least one precious metal (27). Also disclosed are an optical arrangement, preferably a projection exposure apparatus for microlithography, in particular for EUV lithography, which includes at least one such reflective optical element (17), and a method of producing such a reflective optical element (17).

    Method of Measuring a Target, and Metrology Apparatus

    公开(公告)号:US20190219931A1

    公开(公告)日:2019-07-18

    申请号:US16246004

    申请日:2019-01-11

    IPC分类号: G03F7/20 G03F9/00

    摘要: Disclosed is a method of measuring a target, and a metrology apparatus. In one arrangement the target comprises a layered structure. The layered structure has a first target structure in a first layer and a second target structure in a second layer. The method comprises illuminating the target with measurement radiation using an illumination profile in the illumination pupil (u) that is offset from an imaginary line (IL) in the illumination pupil passing through the optical axis, to allow propagation to a detection region of the detection pupil of an allowed order (v2, v4) of a predetermined diffraction order while limiting propagation to the detection region of an equal and opposite order (v1′, v3′) of that predetermined diffraction order. Scattered radiation of plural double-diffracted allowed diffraction orders (w2, w4) is detected. A characteristic of the lithographic process is calculated using the detected scattered radiation of the predetermined diffraction orders.

    PROJECTION EXPOSURE APPARATUS AND METHOD FOR MEASURING AN IMAGING ABERRATION

    公开(公告)号:US20180196350A1

    公开(公告)日:2018-07-12

    申请号:US15869606

    申请日:2018-01-12

    IPC分类号: G03F7/20

    摘要: A microlithographic projection exposure apparatus (10) includes a projection lens (26) that images an object field (22) arranged in a mask plane (24) onto a substrate (28) during exposure operation of the projection exposure apparatus, and an illumination system (16) that has: an exposure illumination beam path (44) for radiating illumination radiation (14) onto the object field on the illumination side with respect to the mask plane, a measurement illumination beam path (48) for irradiating a measurement structure (54) arranged in the mask plane with the illumination radiation, and a scattering structure (50) arranged on the illumination side with respect to the mask plane and outside the exposure illumination beam path. The measurement illumination beam path extends via the scattering structure and runs rectilinearly between the scattering structure and the mask plane.

    NUMERICAL CALCULATION OF THE DIFFRACTION OF A STRUCTURE

    公开(公告)号:US20180046087A1

    公开(公告)日:2018-02-15

    申请号:US15552951

    申请日:2016-02-22

    IPC分类号: G03F7/20 G06F17/12

    摘要: The invention concerns a numerical calculation procedure of the diffraction of a structure (1) whose numerical model defines the dielectric permittivity at each point comprizing the steps of: definition of a numerical modellization of the diffraction model of a structure including: the splitting of the numerical model of the dielectric permittivity into N numerical models of dielectric permittivity; the determination of the diffraction model of the said layers from the numerical model of this layer; numerical calculation of the diffraction of the structure including: an initial iteration during which one performs: one wave propagation in the direction of layers 1 to N, and one wave propagation in the direction of the layers N to 1, ulterior iterations, each ulterior iteration of index k including: one wave propagation in the direction of layers 2 to N: one wave propagation in the direction of layers N−1 to 1.