公开(公告)号：US4604572A

公开(公告)日：1986-08-05

申请号：US673203

申请日：1984-11-19

申请人： Akinori Horiuchi ,  Toshio Binnaka ,  Shigeyuki Maruyama

发明人： Akinori Horiuchi ,  Toshio Binnaka ,  Shigeyuki Maruyama

IPC分类号： G01R1/04 ,  G01R31/28 ,  G01R31/26

CPC分类号： G01R31/2877 ,  G01R1/0458

摘要： Apparatus for testing semiconductor devices at a high temperature comprising: a heating portion where the semiconductor device to be tested is heated to a predetermined temperature; a testing portion; a assembly for holding the chucking semiconductor device, the chucking assembly having a heating element for heating the semiconductor device and a thermosensor; a conveyor assembly for conveying the semiconductor device chucked by the chucking assembly to the testing portion; and, a central processing unit and memory circuit for controlling the temperature of the heating element in response to the output of the thermosensor.

摘要翻译： 用于在高温下测试半导体器件的设备，包括：加热部分，其中待测试的半导体器件被加热到预定温度; 测试部分; 用于保持夹持半导体器件的组件，所述夹紧组件具有用于加热半导体器件的加热元件和热敏传感器; 用于将由夹紧组件夹持的半导体器件传送到测试部分的传送器组件; 以及用于响应于热敏传感器的输出来控制加热元件的温度的中央处理单元和存储器电路。