Abstract:
A thin film package structure is provided. The thin film package structure includes a plurality of film layers arranged on the outside of a device, the plurality of film layers including inorganic and organic layers alternately laminated, wherein the innermost film layer and the outermost film layer among the plurality of film layers are inorganic layers, and an auxiliary spreading layer arranged between at least one pair of an inorganic layer and an organic layer adjacent within the plurality of film layers, wherein the hydrophilicity-hydrophobicity of the auxiliary spreading layer is the same as that of the organic layer in contact with the auxiliary spreading layer.
Abstract:
The present disclosure provides an organic light-emitting diode packaging structure, a method for packaging an organic light-emitting diode and a display device. The packaging structure includes: a display area of an organic light-emitting diode arranged on a substrate; a cathode pattern arranged on the display area; a first inorganic blocking layer arranged on the cathode pattern; an organic buffer layer arranged on the first inorganic blocking layer, wherein the organic buffer layer is electrically connected at its edge to the cathode pattern in a peripheral area of the display area; and a second inorganic blocking layer, wherein the second inorganic blocking layer is connected directly at its edge to the substrate in the peripheral area of the display area, so as to cover all the other layers.
Abstract:
This present disclosure provides an encapsulating layer, an electronic package device and a display apparatus, relates to the field of electronics technology, and may decrease the thickness of the encapsulating layer, thereby achieving lightening and thinning of the electronic package device. The encapsulating layer comprises an encapsulating barrier layer and an organic coating layer directly formed on the encapsulating barrier layer; wherein the organic coating layer is a polymerizable organic coating layer; and the polymerizable organic coating layer comprises an unsaturated acrylate organic coating layer. The encapsulating layer is used for encapsulating an electronic device.
Abstract:
The present invention provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a first substrate, a display component provided on the first substrate, and a packaging structure for packaging the display component on the first substrate, wherein the packaging structure includes at least two first water blocking layers and at least one planarization layer that are stacked alternately above the display component, each first water blocking layer includes a plurality of first areas and a plurality of second areas, and joint lines between the first areas and the second areas in any two first water blocking layers are staggered with each other.
Abstract:
A mask plate, a method for packaging an OLED device and an OLED device are disclosed, the mask plate includes at least one opening for forming a pattern of a package layer; the side of the mask plate close to the OLED device to be packaged has an etching layer which is used to etch the material of a package layer.