公开(公告)号：US20080062641A1

公开(公告)日：2008-03-13

申请号：US11309849

申请日：2006-10-12

申请人： Cheng-Tien Lai ,  Tao Li ,  Wei-Qiang Tian

发明人： Cheng-Tien Lai ,  Tao Li ,  Wei-Qiang Tian

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a fan producing an airflow flowing towards the heat sink, an air-guiding member positioned between the fan and the heat sink and a cover enclosing the fan and the heat sink. The air-guiding member includes an air deflector dividing the airflow produced by the fan into two airstreams. The air deflector guides the airstreams of the airflow flowing towards different portions of the heat sink. By the air deflector, the portion of the heat sink, which is hotter than the other portion of the heat sink, has more air flowing therethrough.

公开(公告)号：US07110259B2

公开(公告)日：2006-09-19

申请号：US10946664

申请日：2004-09-21

申请人： Hsieh Kun Lee ,  Cheng-Tien Lai ,  Zhi-Bin Tan

发明人： Hsieh Kun Lee ,  Cheng-Tien Lai ,  Zhi-Bin Tan

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between the first and second bases. Each of the heat pipes has a heat-absorption end (51, 71) and a heat-dissipation end (52, 72). The heat-absorption ends of the first and second heat pipes contact the first base of the heat sink. The heat-dissipation end of the first heat pipe is inserted in the substantial middle portion of the fins, and the heat-dissipation end of the second heat pipe is inserted between the second base and the fins.

摘要翻译： 包括热管的散热装置包括散热器（10），第一热管（50）和第二热管（70）。 散热器具有第一基座（11），第二基座（21）和夹在第一和第二基座之间的多个翅片。 每个热管具有吸热端（51,71）和散热端（52,72）。 第一和第二热管的吸热端与散热器的第一基座接触。 第一热管的散热端插入散热片的大致中间部分，第二热管的散热端插入第二基座和散热片之间。

公开(公告)号：US07100677B2

公开(公告)日：2006-09-05

申请号：US10900801

申请日：2004-07-27

申请人： Hsieh Kun Lee ,  Cheng-Tien Lai ,  Shi Wen Zhou

发明人： Hsieh Kun Lee ,  Cheng-Tien Lai ,  Shi Wen Zhou

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/473 ,  F28F3/02 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank defines a cavity therein for containing liquid coolant for heat exchange, and an inlet (122) in communication with the cavity. The heat dissipating unit defines a chamber therein in flow communication with the cavity, and an outlet (275) in communication with the chamber. The pump has an entrance (31) in flow communication with the outlet, and an exit (32) in flow communication with the inlet, thereby the tank, the heat dissipating unit, and the pump together forming a loop for circulation the of liquid coolant.

摘要翻译： 液体冷却系统包括用于热接触热源（100）的罐（10），安装在罐上的圆柱形散热单元（20）和位于圆柱形散热单元内的泵（30）。 所述罐在其中限定了用于容纳用于热交换的液体冷却剂的空腔，以及与所述空腔连通的入口（122）。 散热单元限定其中与腔体流动连通的腔室，以及与腔室连通的出口（275）。 泵具有与出口流动连通的入口（31）和与入口流动连通的出口（32），从而使罐，散热单元和泵一起形成用于使液体冷却剂循环的回路 。

公开(公告)号：US07028761B2

公开(公告)日：2006-04-18

申请号：US10901749

申请日：2004-07-28

申请人： Hsieh Kun Lee ,  Cheng-Tien Lai ,  Shi Wen Zhou

发明人： Hsieh Kun Lee ,  Cheng-Tien Lai ,  Shi Wen Zhou

IPC分类号： F28D15/00

CPC分类号： F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling system includes a cooling unit (100) and a coolant driving unit (200). The cooling unit includes a first cooling body (110) defining a first cavity, a second cooling body (130) defining a second cavity in communication with the first cooling body (110), and a heat sink (150) sandwiched between the first and second cooling bodies. The coolant driving unit is in flow communication with the first and second cooling bodies respectively, so that the first and second cooling bodies and the coolant driving unit together form a loop. Circulation of the coolant in the loop causes the heat generated by the heat generating component to be capable of being transferred from the first and second cooling bodies to the heat sink for dissipation.

摘要翻译： 液体冷却系统包括冷却单元（100）和冷却剂驱动单元（200）。 冷却单元包括限定第一空腔的第一冷却体（110），限定与第一冷却体（110）连通的第二空腔的第二冷却体（130）和夹在第一和第二冷却体 第二冷却体。 冷却剂驱动单元分别与第一和第二冷却体流动连通，使得第一和第二冷却体和冷却剂驱动单元一起形成回路。 冷却液在回路中的循环使得由发热部件产生的热量能够从第一和第二冷却体转移到散热器以进行散热。

公开(公告)号：US06808013B2

公开(公告)日：2004-10-26

申请号：US10174770

申请日：2002-06-18

申请人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

发明人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

IPC分类号： F28F700

CPC分类号： F28F7/02 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2021/0029 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device (1) includes a heat sink (12), a number of first pipes (14), a pair of second pipes (16), and working liquid. The heat sink includes a base (122), and a number of fins (124) attached on the base. A number of parallel first holes (126) is defined through the base. A second hole (128) is defined through a middle of the base in a longitudinal direction that is perpendicular to the first holes. The first and second pipes and the first and second holes thus cooperatively form a closed circulatory route. The working liquid is received in the circulatory route. In operations the working liquid absorbs heat at the base and circulates through the circulatory route. The first and second pipes dissipate said heat to airspace beyond the fins. Accordingly, the first and second pipes increase a heat dissipation area of the heat dissipation device.

摘要翻译： 散热装置（1）包括散热器（12），多个第一管（14），一对第二管（16）和工作液体。 散热器包括基座（122）和附接在基座上的多个散热片（124）。 通过基座限定多个平行的第一孔（126）。 第二孔（128）通过垂直于第一孔的纵向的基部的中部限定。 第一和第二管道以及第一和第二孔因此协同地形成封闭的循环路线。 工作液体在循环路线中接收。 在操作中，工作液体吸收底部的热量并循环通过循环路线。 第一和第二管道将所述热量散发到翅片之外的空域。 因此，第一和第二管道增加了散热装置的散热面积。

公开(公告)号：US06646881B1

公开(公告)日：2003-11-11

申请号：US10301974

申请日：2002-11-21

申请人： Cheng-Tien Lai ,  ShengHua Wang

发明人： Cheng-Tien Lai ,  ShengHua Wang

IPC分类号： H05K720

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  Y10T24/44026 ,  H01L2924/00

摘要： A mounting assembly for securing a heat sink (10) to an electronic package (50) mounted on a circuit board (40) includes a back plate (20), a clip (30), and two screws (70). The back plate abuts an underside of the circuit board. The back plate includes a cross-shaped main body (22), and two first positioning posts (24) and two second positioning posts (26). An annular groove (242) and a threaded hole (262) are defined in each first and each second positioning post respectively. The clip includes a horizontal portion (32), and two first legs (34) and two second legs (36). A guiding hole (342) and a communicating positioning slot (344) are defined in each first leg, the positioning slot engagingly receiving a corresponding first positioning post. A fastening slot (362) is defined in each second leg. The screws are inserted through the fastening slots into the corresponding threaded holes.

摘要翻译： 用于将散热器（10）固定到安装在电路板（40）上的电子封装（50）的安装组件包括背板（20），夹子（30）和两个螺钉（70）。 背板邻接电路板的下侧。 背板包括十字形主体（22）和两个第一定位柱（24）和两个第二定位柱（26）。 分别在每个第一定位柱和每个第二定位柱中限定环形槽（242）和螺纹孔（262）。 夹具包括水平部分（32）和两个第一腿部（34）和两个第二腿部（36）。 在每个第一腿部中限定有引导孔（342）和连通定位槽（344），所述定位槽啮合地接收对应的第一定位柱。 在每个第二支腿中限定紧固槽（362）。 螺钉通过紧固槽插入到相应的螺纹孔中。

公开(公告)号：US06480388B1

公开(公告)日：2002-11-12

申请号：US10103004

申请日：2002-03-20

申请人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Zili Zhang

发明人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Zili Zhang

IPC分类号： H05K720

CPC分类号： H01L23/36 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/1007 ,  H01L2924/00

摘要： A back plate assembly includes a back plate (40) for being attached to an underside of a motherboard (20), a plurality of posts (60), and a plurality of clips (80). The motherboard defines a plurality of through apertures (22). The back plate defines a plurality of through holes (48). Each clip defines a star-shaped cutout (82) in a middle of a round base (82) thereof, to thereby form a plurality of inwardly extending resilient teeth (84). The teeth slant upwardly from a periphery of the base toward a middle of the cutout. In assembly, the posts are extended through the corresponding through holes and through apertures. The clips are then placed on top ends of the posts and downwardly pushed until the clips abut the motherboard. The teeth are elastically deformed to thereby securely retain the posts in the motherboard. The back plate is thus securely attached to the motherboard.

摘要翻译： 背板组件包括用于附接到母板（20）的下侧的后板（40），多个柱（60）和多个夹子（80）。 主板限定多个通孔（22）。 后板限定多个通孔（48）。 每个夹子在其圆形基部（82）的中间限定了星形切口（82），从而形成多个向内延伸的弹性齿（84）。 齿从基部的周边朝切口的中间向上倾斜。 在组装中，柱通过相应的通孔延伸穿过孔。 然后将夹子放置在柱的顶端并向下推动直到夹子抵靠主板。 牙齿弹性变形，从而可靠地将柱固定在母板上。 因此，背板牢固地附接到母板。

公开(公告)号：US08052300B2

公开(公告)日：2011-11-08

申请号：US12274358

申请日：2008-11-20

申请人： Yi Zhang ,  Jin-Song Feng ,  Cheng-Tien Lai

发明人： Yi Zhang ,  Jin-Song Feng ,  Cheng-Tien Lai

IPC分类号： F21S4/00 ,  F21V29/00

CPC分类号： F21V29/004 ,  F21S2/005 ,  F21V19/001 ,  F21V29/713 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates.

摘要翻译： LED灯包括散热器，安装在散热器上的多个散热片阵列和安装在散热片阵列上的多个LED模块。 散热器包括基部和从基部延伸的多个散热翅片。 翅片阵列安装在散热器底座的顶表面上。 每个翅片阵列由互锁在一起的多个翅片组成。 每个翅片阵列具有与基部的顶表面接触的底部安装表面和相对于基部的顶部表面以锐角限定的顶部接合表面。 LED模块分别通过吸热板安装在翅片阵列的接合表面上。

公开(公告)号：US07789242B2

公开(公告)日：2010-09-07

申请号：US12200872

申请日：2008-08-28

申请人： Chun-Jiang Shuai ,  Guang Yu ,  Cheng-Tien Lai

发明人： Chun-Jiang Shuai ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： B65D85/00

CPC分类号： F21V17/007 ,  B65D43/12 ,  B65D2585/86 ,  F21S4/20 ,  F21Y2115/10

摘要： A protective packaging for protecting an LED module from being damaged during transportation, includes a housing containing the LED module therein and a cover slidably fixed in the housing to cover a top opening of the housing. The housing defines a room to receive the LED module therein. A bottom portion of the housing is concaved to form a space, in which a thermal interface material bonded on the LED module is accommodated. An end of the housing is closed to abut against an end of the cover, and an opposite end of the housing is partially opened to receive an opposite end of the cover. The protective packaging is made from an antistatic plastic and has a wall thickness larger than 0.5 mm.

摘要翻译： 用于保护LED模块在运输过程中不被损坏的保护性包装包括其中包含LED模块的壳体和可滑动地固定在壳体中以覆盖壳体的顶部开口的盖子。 壳体定义了在其中接收LED模块的房间。 壳体的底部凹陷以形成容纳结合在LED模块上的热界面材料的空间。 壳体的端部被封闭以抵靠盖的端部，并且壳体的相对端部分地打开以容纳盖的相对端。 保护性包装由防静电塑料制成，壁厚大于0.5mm。

公开(公告)号：US07762689B2

公开(公告)日：2010-07-27

申请号：US11933996

申请日：2007-11-01

申请人： Fang-Wei Xu ,  Guang Yu ,  Cheng-Tien Lai

发明人： Fang-Wei Xu ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： F21V29/00

CPC分类号： F21V29/763 ,  F21K9/00 ,  F21V29/51 ,  F21V29/75 ,  F21Y2115/10

摘要： An LED lamp includes a heat dissipation apparatus with a base, an LED module mounted on the base, and an AC-DC converter electrically connected to the LED module. The AC-DC converter is mounted on the base near the LED module. Heat generated by the LED module and heat-generating components of the AC-DC converter is transferred to the base from which the heat is dissipated by the heat dissipation apparatus. Heat pipes are embedded in the base of the heat dissipation apparatus.

摘要翻译： LED灯包括具有基座的散热装置，安装在基座上的LED模块以及与LED模块电连接的AC-DC转换器。 AC-DC转换器安装在LED模块附近的基座上。 由LED模块产生的热量和AC-DC转换器的发热部件传递到由散热装置散热的基座。 热管埋在散热装置的底部。