公开(公告)号：US20130104399A1

公开(公告)日：2013-05-02

申请号：US13684736

申请日：2012-11-26

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20709 ,  H05K7/20781

Abstract: A method is provided which includes providing a multi-rack assembly having adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

Abstract translation: 提供了一种方法，其包括提供具有相邻的第一和第二电子机架的多齿条组件，每个电子机架至少部分地被空气冷却，以及与第一齿条相关联的空气与液体热交换器，用于冷却至少一部分 空气通过第一个机架。 该热交换器设置在第一齿条的空气入口或空气出口侧，并且与冷却剂回路流体连通地连接以接收来自回路的冷却剂并将冷却剂排出到回路，将来自经过其的空气的热量传递给冷却剂 通过 组件还包括与第一齿条相关联的冷却单元和冷却剂回路中的冷却冷却剂，以及与第二齿条相关联的气流引导件，并且便于管道通过第二齿条的至少一部分空气也穿过热 交换机与第一个机架相关联。