公开(公告)号：US20160088777A1

公开(公告)日：2016-03-24

申请号：US14960862

申请日：2015-12-07

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  G05B15/02

CPC分类号： H05K7/20836 ,  G05B15/02 ,  G05D23/1932 ,  H05K7/2079

摘要： Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

摘要翻译： 部分地基于组件的加权冷却效率来提供电子系统的冷却系统冷却的能量效率控制。 该控制包括自动确定冷却系统的多个可调冷却部件的速度控制设置。 所述自动确定至少部分地基于所述冷却系统的组件的加权冷却效果，并且所述确定操作以限制至少所述冷却系统的功率消耗，同时确保与至少一个 冷却系统或电子系统在所需的范围内，通过基于加权的冷却效果，提供冷却系统的多个可调冷却部件之间的期望的目标温度变化。 供应包括至少部分地通过所确定的控制设置向多个可调冷却部件供应应用的功率。

公开(公告)号：US20150359137A1

公开(公告)日：2015-12-10

申请号：US14827588

申请日：2015-08-17

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/2039 ,  H05K7/20254 ,  H05K7/20772

摘要： Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.

公开(公告)号：US20150359132A1

公开(公告)日：2015-12-10

申请号：US14827617

申请日：2015-08-17

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/203 ,  H05K7/20 ,  H05K7/20236 ,  H05K7/20336 ,  H05K7/20781

摘要： A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

摘要翻译： 提供了一种冷却的电子系统和冷却方法，其中一个现场可替换的电子部件组由一种装置冷却，该装置包括至少部分围绕电子部件周围并形成隔室的外壳，设置在隔间内的流体 与外壳相关的散热器。 现场可更换组件部分地延伸通过外壳以便于将电子部件与电子系统的一个或多个相应的接收插座的操作对接。 现场可更换组的电子部件至少部分地浸没在流体内以便于部件的浸入冷却，并且散热器有助于排除设置在隔室内的流体的热量。 在一个实施例中，多个热导体从壳体的内表面突出到隔室中以便于将热量从流体传递到散热器。

公开(公告)号：US20150173251A1

公开(公告)日：2015-06-18

申请号：US14132230

申请日：2013-12-18

申请人： International Business Machines Corporation

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  B23P15/26

CPC分类号： H05K7/20218 ,  H05K7/2039 ,  H05K7/20772 ,  Y10T29/4935

摘要： Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

摘要翻译： 提供冷却装置，冷却的电子模块和制造方法，其促进从电子部件的热传递。 冷却装置包括具有导热结构的液冷式散热器，该导热结构具有包括减小横截面冷却剂流动面积的区域的冷却剂输送室。 散热器包括与隔室流体连通的冷却剂入口和出口，并且减小的横截面冷却剂流动区域的区域提供了导电结构的主传热表面与冷却剂之间增加的有效传热系数。 冷却装置还包括联接到冷却剂入口和出口的冷却剂回路，以便于冷却剂流过冷却剂携带室，以及冷却剂过滤器，其被定位成过滤来自穿过散热器的冷却剂的污染物。 冷却剂过滤器具有比截面冷却剂流动面积减小的区域更大的横截面冷却剂流动面积。

公开(公告)号：US20150138715A1

公开(公告)日：2015-05-21

申请号：US14564250

申请日：2014-12-09

申请人： International Business Machines Corporation

发明人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

IPC分类号： H05K7/20 ,  F25B21/04

CPC分类号： H05K7/20763 ,  F25B21/02 ,  F25B21/04 ,  F25D17/06 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836

摘要： Methods are provided for facilitating cooling of an electronic component. The methods include providing: a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.

摘要翻译： 提供了便于冷却电子部件的方法。 所述方法包括提供：液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路和室外空气 冷却热交换单元，其耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。 热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。 在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。

公开(公告)号：US20140158341A1

公开(公告)日：2014-06-12

申请号：US13783628

申请日：2013-03-04

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28F27/00

CPC分类号： F16K31/002 ,  F28F3/12 ,  F28F27/00 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

摘要： Methods are presented for facilitating dissipation of heat generated by one or more electronic components. The methods include providing a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).

摘要翻译： 提出了用于促进由一个或多个电子部件产生的热量消散的方法。 这些方法包括提供冷却剂冷却的散热器和恒温控制阀。 散热器包括一个或多个冷却剂承载通道和与通道相交的一个或多个阀井。 恒温控制阀至少部分地设置在相应的阀井内，以与相应的冷却剂承载通道相交，并且包括阀盘和机械耦合以旋转阀盘的热敏致动器。 阀盘可以在允许冷却剂流过相应的冷却剂输送通道的打开位置和阻止冷却剂流过相应通道的关闭位置之间旋转。 执行器根据电子部件对热敏致动器的加热，使阀盘在打开位置和关闭位置之间旋转。

公开(公告)号：US20140126151A1

公开(公告)日：2014-05-08

申请号：US13781993

申请日：2013-03-01

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/2079 ,  G05D23/1934 ,  G06F1/206 ,  H05K7/20836

摘要： Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.

摘要翻译： 提供了用于自动冷却剂流控制的方法，例如，促进多个不同电子系统的冷却。 这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂 电路i基于传输到冷却剂的确定的热负荷。 不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。

公开(公告)号：US20140068943A1

公开(公告)日：2014-03-13

申请号：US13788798

申请日：2013-03-07

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： B21D53/02

CPC分类号： B21D53/02 ,  F25B21/02 ,  F25B2321/0252 ,  H05K7/2079 ,  Y10T29/49359

摘要： Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

摘要翻译： 提供一种电子系统的热电增强空气和液体冷却是通过提供一种冷却装置来实现的，所述冷却装置包括与电子部件热连通的液冷结构，以及液体 - 液体和空气 - 液体热交换器 通过冷却剂回路串联流体连通，其包括并联连接的第一和第二回路部分。 液冷结构经由第一回路部分供应冷却剂，热电阵列设置有第一和第二回路部分与阵列的第一和第二侧热接触。 热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。 通过第一和第二回路部分的冷却剂通过串联耦合的热交换器，其中一个用作散热器。

公开(公告)号：US20140055949A1

公开(公告)日：2014-02-27

申请号：US14063141

申请日：2013-10-25

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. Ellsworth, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/202 ,  F28D1/0471 ,  F28D1/0475 ,  F28D1/05366 ,  F28D2021/0038 ,  F28F1/126 ,  F28F1/32 ,  F28F17/005 ,  H05K7/20218 ,  H05K7/20318 ,  H05K7/20572 ,  H05K7/20609 ,  H05K7/20627 ,  H05K7/20645 ,  H05K7/20736 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20836

摘要： Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

摘要翻译： 为电子机架提供除湿冷却装置和方法。 该装置包括设置在机架的空气入口侧或出口侧的空气 - 液体热交换器，其中空气从进气口流过空气出口侧。 热交换器被定位成用于空气通过电子机架以通过热交换器，并且与冷却剂回路流体连通，以在低于通过热交换器的空气的露点温度的温度下使冷却剂通过其中，使得 通过热交换器的空气被除湿并冷却。 设置在热交换器下方的冷凝水收集器从通过电子机架的空气的除湿收集液体冷凝物，其中热交换器包括多个倾斜表面，其被构造成便于将液体冷凝物从热交换器排出到冷凝水收集器。

公开(公告)号：US20140053575A1

公开(公告)日：2014-02-27

申请号：US14066769

申请日：2013-10-30

申请人： International Business Machines Corporation

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B21/02 ,  B23P15/26

CPC分类号： F25B21/02 ,  B23P15/26 ,  F25B43/00 ,  F25B43/003 ,  F25B2400/01 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49359

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩式制冷系统，其包括膨胀部件，蒸发器，压缩机和流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通的污染物分离器。 分离器包括制冷剂冷滤器和热电阵列。 通过制冷剂流路的制冷剂的至少一部分通过冷过滤器，并且热电阵列向冷过滤器提供冷却以冷却通过过滤器的制冷剂。 通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在冷过滤器中。 分离器还可以包括耦合到热电阵列的热侧的制冷剂热过滤器，用于进一步过滤制冷剂。