-
公开(公告)号：US20230077722A1
公开(公告)日：2023-03-16
申请号：US17474272
申请日：2021-09-14
摘要： Apparatuses and methods of fabrication are provided which include a mechanical coolant pump to facilitate pumping a coolant through a coolant loop. The mechanical coolant pump is to couple to an individual and be physically powered by a specified movement of the individual to pump coolant. Coolant pumped by the mechanical coolant pump is circulated by the coolant pump through a device associated with the individual to cool the device.
-
公开(公告)号：US20190340552A1
公开(公告)日：2019-11-07
申请号：US15968890
申请日：2018-05-02
摘要： Automated managing of a data center installation is provided. The managing includes evaluating, at least in part by image processing analysis, a captured image of at least a portion of the data center installation to identify a component-related deficiency within the data center installation. One or more measurements within a data center are used to determine an energy penalty due to the identified component-related deficiency within the data center installation, and an action to correct the component-related deficiency within the data center installation is initiated based on the energy penalty exceeding a predefined threshold.
-
公开(公告)号：US20180328236A1
公开(公告)日：2018-11-15
申请号：US16043263
申请日：2018-07-24
CPC分类号： F01K25/08 , F01K5/00 , F25B15/00 , F25B19/00 , F25B27/02 , F25B49/00 , H02P9/04 , H05K7/20709 , H05K7/20818 , H05K7/20836
摘要： Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
-
公开(公告)号：US20170316228A1
公开(公告)日：2017-11-02
申请号：US15139503
申请日：2016-04-27
CPC分类号： G06F21/86 , G06F21/62 , H05K1/0272 , H05K1/0275 , H05K1/0298 , H05K1/182 , H05K5/0208 , H05K5/067 , H05K5/069 , H05K7/203 , H05K7/20318 , H05K2201/10151 , H05K2203/0776
摘要： Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.
-
公开(公告)号：US20170045300A1
公开(公告)日：2017-02-16
申请号：US14824492
申请日：2015-08-12
发明人： Dylan J. BODAY , Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS , Prabjit SINGH , Jason T. WERTZ
CPC分类号： B23P15/26 , B23P2700/10 , F28F3/02 , F28F3/12 , H01L23/473 , H01L23/4735 , H05K7/20254 , H05K7/20772
摘要： Liquid-cooled heat sink assemblies are provided which include: a heat transfer element including a heat transfer base with opposite first and second sides and a plurality of thermally conductive fins extending from the first side, and with the second side of the heat transfer base to couple to a component(s) to be cooled. The heat sink assembly further includes a coolant-carrying structure attached to the heat transfer element. The coolant-carrying structure includes a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows. The coolant-carrying base includes a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins to extend therethrough. The plurality of thermally conductive fins extend into the coolant-carrying compartment through which the liquid coolant flows. In one or more embodiments, the heat transfer element is a metal structure and the coolant-carrying structure is a plastic structure.
摘要翻译： 提供了液冷式散热器组件，其包括：传热元件，其包括具有相对的第一和第二侧的传热基部和从第一侧延伸的多个导热翅片，以及传热基座的第二侧至 耦合到要冷却的部件。 散热器组件还包括附接到传热元件的冷却剂承载结构。 冷却剂承载结构包括冷却剂承载基座和液体冷却剂流过的冷却剂输送室。 冷却剂承载基座包括多个翅片接收开口，其大小和定位用于多个导热翅片延伸穿过其中。 多个导热翅片延伸到液体冷却剂流过的冷却剂供给室中。 在一个或多个实施例中，传热元件是金属结构，并且冷却剂承载结构是塑料结构。
-
公开(公告)号：US20160143184A1
公开(公告)日：2016-05-19
申请号：US14828775
申请日：2015-08-18
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20218 , H01L23/34 , H01L23/3672 , H01L23/4006 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/20281 , H05K7/20327 , H05K7/2039 , H05K7/20436 , H05K7/20509 , H05K7/20772 , H01L2924/00
摘要： Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure.
摘要翻译： 提供了液冷式散热器组件，其包括：具有侧壁表面和主传热表面的导热基底结构; 以及附接到基部结构的歧管结构，其中基部结构至少部分地位于歧管结构中的凹部内。 基座和歧管结构一起限定了一个冷却剂供给室，液体冷却剂至少部分地沿基本上平行于基础结构的主传热表面的方向流动，并且至少一个侧壁表面 歧管结构的导热基底结构或其相对的表面包括连续的凹槽。 密封构件至少部分地设置在连续槽内，并且在导热基底结构和歧管结构之间提供流体密封的密封。
-
公开(公告)号：US20160095263A1
公开(公告)日：2016-03-31
申请号：US14831105
申请日：2015-08-20
发明人： Levi A. CAMPBELL , Christopher R. CIRAULO , Milnes P. DAVID , Dustin W. DEMETRIOU , John J. LOPARCO , Robert K. MULLADY , Donald W. PORTER , Roger R. SCHMIDT , Richard P. SNIDER , John G. TOROK
CPC分类号： H05K7/20736 , F24F7/04 , H05K7/20172 , H05K7/20727
摘要： Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state.
摘要翻译： 提供了设备和方法，用于在操作状态下防止从底盘移除空气移动组件。 该装置包括具有滑动元件和一个或多个互锁元件的互锁组件。 滑动元件可滑动地联接到空气移动组件，并且当空气移动组件处于操作状态时处于第一位置，并且当空气移动组件处于静止状态时，滑动元件可滑动到第二位置。 滑动元件防止空气移动组件在第一位置从底盘移除，并且允许空气移动组件在第二位置从底盘移除。 互锁元件与滑动元件相关联并且当空气移动组件处于操作状态时防止滑动元件从第一位置滑动到第二位置。
-
公开(公告)号：US20150109730A1
公开(公告)日：2015-04-23
申请号：US14058546
申请日：2013-10-21
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
CPC分类号： H05K7/203 , F25B23/006 , F28B3/04 , F28D15/0266 , H05K7/20809 , Y10T29/4935
摘要： Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser which includes a condenser housing with a condensing chamber accommodating the working fluid and coolant, which are in direct contact within the condensing chamber and are immiscible fluids. The condensing chamber includes a working fluid vapor layer and a working fluid liquid layer; and a working fluid vapor inlet facilitates flow of fluid vapor into the condensing chamber, and a working fluid vapor outlet facilitates egress of working fluid liquid from the condensing chamber. A coolant inlet structure facilitates ingress of coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing the vapor into working fluid liquid, and the coolant outlet structure facilitates subsequent egress of coolant from the condensing chamber.
摘要翻译： 提供了冷却装置和方法，便于将热量从工作流体传递到冷却剂。 冷却装置包括蒸气冷凝器，其包括具有容纳工作流体和冷却剂的冷凝室的冷凝器壳体，其在冷凝室内直接接触并且是不混溶的流体。 冷凝室包括工作流体蒸汽层和工作流体液体层; 并且工作流体蒸气入口促进流体蒸汽流入冷凝室，并且工作流体蒸气出口便于从冷凝室排出工作流体液体。 冷却剂入口结构有助于将冷却剂进入冷凝室的工作流体蒸汽层，与工作流体蒸汽直接接触，以便于将蒸汽冷凝成工作流体液体，并且冷却剂出口结构便于后续从冷凝室排出冷却剂 。
-
公开(公告)号：US20140133096A1
公开(公告)日：2014-05-15
申请号：US13674207
申请日：2012-11-12
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
CPC分类号： F28F9/00 , H05K7/20781
摘要： A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.
摘要翻译： 提供了一种用于电子机架的冷却装置，其包括在机架的入口或空气出口侧处联接到电子机架的门组件。 门组件包括：气流开口，其构造成便于通过安装到机架的门组件通过电子机架进入或流出气流; 空气冷却剂热交换器，其布置成使得通过气流开口的气流穿过空气 - 冷却剂热交换器，空气 - 冷却剂热交换器被配置为从通过其的气流中提取热量; 以及蒸汽冷凝器，其被配置为便于从电子机架的至少一个浸没冷却的电子部件部分排出的介电流体蒸气的冷凝。 包括门组件的冷却装置有助于电子机架的不同电子部件的空气冷却和浸没冷却。
-
公开(公告)号：US20140126149A1
公开(公告)日：2014-05-08
申请号：US13671887
申请日：2012-11-08
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , G05D23/1934 , G06F1/206 , H05K7/20836
摘要： Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.
摘要翻译： 方法和冷却剂分配系统被提供用于自动冷却剂流控制，例如，促进多个不同电子系统的冷却。 这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂 电路i基于传输到冷却剂的确定的热负荷。 不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。
-
-
-
-
-
-
-
-
-
搜索结果
101 条记录 (耗时 0.028 秒)
