公开(公告)号：US20160163924A1

公开(公告)日：2016-06-09

申请号：US15046038

申请日：2016-02-17

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kenichi Wakimoto ,  Akihiro Chida ,  Kohei Yokoyama

IPC: H01L33/20 ,  H01L33/36 ,  H01L33/62

CPC classification number: H01L33/20 ,  H01L33/36 ,  H01L33/62 ,  H01L51/5203 ,  H01L51/5212 ,  H01L51/5237 ,  H01L51/524 ,  H01L51/5243 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L51/5275 ,  H01L2251/5361

Abstract: A lighting device including an electroluminescent (EL) material is connected to an external power supply easily and the convenience is improved. In a lighting device having a light-emitting element including an electroluminescence (EL) layer, a housing including a light-emitting element has a terminal electrode electrically connected to the light-emitting element on a peripheral end portion. The terminal electrode provided on the housing so as to be exposed to the outside is in contact with a terminal electrode for the external power supply, so that the external power supply and the light-emitting element are electrically connected to each other and power can be supplied to the lighting device.

Abstract translation: 包括电致发光（EL）材料的照明装置容易地连接到外部电源，并且便利性得到改善。 在具有包含电致发光（EL）层的发光元件的照明装置中，包括发光元件的壳体具有在外周端部与发光元件电连接的端子电极。 设置在壳体上以暴露于外部的端子电极与用于外部电源的端子电极接触，使得外部电源和发光元件彼此电连接，并且电力可以是 提供给照明装置。

公开(公告)号：US20150044792A1

公开(公告)日：2015-02-12

申请号：US14450463

申请日：2014-08-04

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tomoya Aoyama ,  Akihiro Chida ,  Ryu Komatsu

IPC: H01L51/56 ,  H01L51/52 ,  H01L51/00

CPC classification number: H01L51/56 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/524

Abstract: To improve the yield in a peeling process and improve the yield in a manufacturing process of a flexible light-emitting device or the like, a peeling method includes a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled including a first layer in contact with the peeling layer over the peeling layer, a third step of curing a bonding layer in an overlapping manner with the peeling layer and the layer to be peeled, a fourth step of removing part of the first layer overlapping with the peeled layer and the bonding layer to form a peeling starting point, and a fifth step of separating the peeling layer and the layer to be peeled. The peeling starting point is preferably formed by laser light irradiation.

Abstract translation: 为了提高剥离工序的产率，提高柔性发光装置等的制造工序的成品率，剥离方法包括在第一基板上形成剥离层的第一工序，第二工序， 要剥离的层包括在剥离层上与剥离层接触的第一层，第三步骤，以与剥离层和被剥离层重叠的方式固化接合层;第四步骤， 第一层与剥离层和接合层重叠以形成剥离起点，以及分离剥离层和被剥离层的第五步骤。 剥离起始点优选通过激光照射形成。