Automatic original document feeding device which has different
procedures for correcting paper jams depending on where the jam occurs
    106.
    发明授权
    Automatic original document feeding device which has different procedures for correcting paper jams depending on where the jam occurs 失效
    自动原稿输送装置,具有根据卡纸发生位置纠正卡纸的不同程序

    公开(公告)号:US5971388A

    公开(公告)日:1999-10-26

    申请号:US607354

    申请日:1996-02-26

    IPC分类号: B65H5/06 B65H5/00

    摘要: An automatic original document feeding device which can shorten a length of time required for refeeding sheets of the original document after a jamming of a sheet of the original document is cleared. When a trouble signal is received indicating that a sheet of the original document remains within a feed path due to an improper feeding or a jamming before the sheet is completely scanned, a side cover is opened and at the same time a driving mechanism is actuated for automatically lowering the sheets of the original document from a feeding position. If the jamming occurs at a later position in the paper path after the image has been completely scanned, the side cover does not have to be opened, the driving mechanism is not lowered, and the sheets of the original document remain in their feeding position.

    摘要翻译: 自动原稿输送装置可以在原稿的纸张卡住之后,缩短原稿的再供纸张所需的时间长度。 当收到的故障信号指示由于在纸张被完全扫描之前由于不正确的馈送或卡纸而导致原稿的纸张保持在进给路径内时,侧盖被打开,并且同时驱动驱动机构 自动将原始文件的纸张从进纸位置下降。 如果在图像被完全扫描之后卡纸发生在纸张路径中的稍后位置,则侧盖不必被打开,驱动机构不会下降,并且原始文档的纸张保持在其进给位置。

    Circuit wafer and TEG test pad electrode
    107.
    发明授权
    Circuit wafer and TEG test pad electrode 失效
    电路晶圆和TEG测试焊盘电极

    公开(公告)号:US5654582A

    公开(公告)日:1997-08-05

    申请号:US435594

    申请日:1995-05-05

    CPC分类号: H01L22/34

    摘要: A semiconductor wafer and semiconductor device manufactured from the wafer. The wafer has a conductive layer 33A intermittently formed in the longitudinal direction of a scribe area 2. The conductive layer's width shorter width than its length and shaped so that the scribe area is cut in the longtitudinal direction including the location of said width. The invention provides a semiconductor wafer not giving rise to faults, such as short-circuiting due to shavings, and not requiring any modification in the scribed width, blade width, or pad size when sawing conductive layers in the scribe area, such as the above-mentioned pads of the TEG.

    摘要翻译: 从晶片制造的半导体晶片和半导体器件。 该晶片具有在划线区域2的长度方向上间断地形成的导电层33A。导电层的宽度比其长度短的宽度,并且成形为使得划线区域在包括所述宽度的位置的纵向上被切割。 本发明提供了一种半导体晶片,其不会产生诸如由于刨花造成短路的故障,并且当在划线区域(例如上述)中锯切导电层时,不需要对划线宽度,刀片宽度或焊盘尺寸进行任何修改 提到的TEG垫。

    Creasing device and image forming system
    109.
    发明授权
    Creasing device and image forming system 有权
    压痕装置和成像系统

    公开(公告)号:US08528891B2

    公开(公告)日:2013-09-10

    申请号:US13327907

    申请日:2011-12-16

    IPC分类号: B31F1/08

    摘要: A creasing device includes: a first member including a creasing blade; a first receiving member including an attachment surface where the first member is to be attached; a second member arranged to face the first member and including a first creasing channel and a second creasing channel opposite to the first creasing channel, the first creasing channel configured to allow the creasing blade to be fitted thereinto with the sheet between the first creasing channel and the creasing blade, the second creasing channel configured to allow the creasing blade to be fitted thereinto with the sheet between the second creasing channel and the creasing blade; a second receiving member including an attachment surface where the second member is to be attached; and a driving section that brings the first and second members into contact with each other and separates the first member and the second member from one another.

    摘要翻译: 折痕装置包括:包括折痕刀片的第一构件; 第一接收构件,其包括附接表面,第一构件将被附接; 第二构件,其布置成面对第一构件并且包括与第一折痕通道相对的第一折痕通道和第二折痕通道,第一折痕通道构造成允许折皱刀片与片材配合在第一折痕通道和第一折痕通道之间, 折痕刀片,第二折痕通道,其构造成允许压痕刀片与片材夹在第二折痕通道和折痕刀片之间; 第二接收构件,其包括附接表面,第二构件将被附接; 以及使第一和第二构件彼此接触并将第一构件和第二构件彼此分离的驱动部。

    Creasing apparatus and image forming system
    110.
    发明授权
    Creasing apparatus and image forming system 失效
    压痕装置和成像系统

    公开(公告)号:US08424859B2

    公开(公告)日:2013-04-23

    申请号:US13317940

    申请日:2011-11-01

    IPC分类号: B31F1/08

    摘要: A creasing apparatus forming a crease on sheets one by one includes: a first member having a linear convex blade formed in a direction perpendicular to a sheet conveying direction; a second member having a concave blade being paired with the convex blade; and a drive unit that moves the first and second members so as to cause the convex blade and the concave blade to form a crease on a sheet stopped at a predetermined position. The first member forms the convex blade with first comb and second comb and the second member forms the concave blade with third comb and fourth comb that advance and retract relative to each other. The drive unit selects advanced and retracted positions of the first comb and second comb and advanced and retracted positions of the third comb and fourth comb so as to perform a creasing process or a perforating process.

    摘要翻译: 在片材上逐一形成折痕的折痕装置包括:具有在垂直于片材输送方向的方向上形成的线状凸起片的第一部件; 第二构件,具有与所述凸形刀片成对的凹形刀片; 以及驱动单元,其使第一和第二构件移动,以使凸形刀片和凹形刀片在停止在预定位置的片材上形成折痕。 第一构件用第一梳子和第二梳子形成凸形刀片,并且第二构件形成具有相对于彼此前进和后退的第三梳状物和第四梳状物的凹形刀片。 驱动单元选择第三梳和第四梳的第一梳和第二梳和先进和缩进位置的先进和缩回位置,以执行折痕处理或穿孔处理。