公开(公告)号：US10852492B1

公开(公告)日：2020-12-01

申请号：US14926868

申请日：2015-10-29

Applicant: Acacia Communications, Inc.

Inventor： Diedrik Vermeulen ,  Christopher Doerr

IPC: G02B6/42 ,  G02B6/125 ,  G02B6/12

Abstract: Structures and methods for passively aligning a photonic die with a receiving substrate are described. Three alignment surfaces, having dimensions greater than a desired alignment accuracy, may be formed on the photonic die and used to passively and accurately align the photonic die to a receiving substrate in six degrees of freedom. Two of the three alignment surfaces on the photonic die may be formed in a single mask-and-etch process, while the third alignment surface may require no patterning or etching. Three complementary alignment surfaces on the receiving substrate may be formed in a single mask-and-etch process.

公开(公告)号：US10798756B1

公开(公告)日：2020-10-06

申请号：US16549273

申请日：2019-08-23

Applicant: Acacia Communications, Inc.

Inventor： Pierre Humblet

IPC: H04W76/10 ,  H04W72/04 ,  H04W28/20

Abstract: Techniques for performing forward error correction of data to be transmitted over an optical communications channel. The techniques include: receiving data bits; organizing the data bits into an arrangement having a plurality of blocks organized into rows and columns and into a plurality of strands including a first strand of blocks that includes a back portion comprising a first row of the plurality of blocks, and a front portion comprising blocks from at least two different columns in at least two different rows other than the first row of blocks; and encoding at least some of the data bits in the arrangement using a first error correcting code at least in part by generating first parity bits by applying the first error correcting code to first data bits in the front portion of the first strands and second data bits in the back portion of the first strand.

公开(公告)号：US10714894B1

公开(公告)日：2020-07-14

申请号：US15938398

申请日：2018-03-28

Applicant: ACACIA COMMUNICATIONS, INC.

Inventor： Christopher Doerr ,  Li Chen ,  Long Chen

IPC: H01S5/14 ,  H01S5/062 ,  H01S5/10 ,  H01S5/024 ,  H01S5/30 ,  H01S5/06

Abstract: In a first embodiment, an external cavity tunable laser, comprising a silicon photonics circuit comprising one or more resonators having one or more p-i-n junctions; wherein a voltage is applied to one or more of the p-i-n junctions. In a second embodiment, a method of operating an external cavity tunable laser, comprising sweeping out free-carriers from a resonator of the tunable laser by applying a voltage to a p-i-n junction of a waveguide of the resonator.

公开(公告)号：US10673161B1

公开(公告)日：2020-06-02

申请号：US16357702

申请日：2019-03-19

Applicant: Acacia Communications, Inc.

Inventor： David Mullert

IPC: H01R12/00 ,  H01R12/73 ,  H01R12/72

Abstract: A system and apparatus for increasing connectivity of a circuit board comprising a connector, wherein the connector has a horizontal body and a hollow cylindrical portion extruding vertically from the body; wherein the cylindrical portion is made up of a set of pieces; wherein at least a piece of the set of pieces is arranged to expand horizontally upon insertion of a phalanx head in a vertical manner. A method to increase current connectivity comprising screwing a fastener into threads of a connector through a hollow cylindrical portion of the connector; wherein the hollow cylindrical portion of the connector is made up of a set of pieces; wherein the screwing causes a phalanx head to contact the cylindrical portion expanding at least one piece of the set of pieces in a horizontal manner in relation to the fastener.

公开(公告)号：US10578799B2

公开(公告)日：2020-03-03

申请号：US15870468

申请日：2018-01-12

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Eric Swanson ,  Diedrik Vermeulen ,  Saeid Azemati ,  Jon Stahl

IPC: G02B6/12 ,  G02B6/10 ,  G02B6/42

Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

公开(公告)号：US10567209B1

公开(公告)日：2020-02-18

申请号：US16224174

申请日：2018-12-18

Applicant: Acacia Communications, Inc.

Inventor： Mehmet Aydinlik ,  Timo Pfau ,  Christian Rasmussen

IPC: H04L27/34 ,  H04L27/36

Abstract: A method, system, and apparatus for encoding a data for transmission across a communication link, the comprising encoding the data into a constellation; wherein the constellation is of a power 2n; wherein n is an odd number; wherein encoding the constellation creates outer constellation points forming a square at an edge of the constellation.

公开(公告)号：US10268055B1

公开(公告)日：2019-04-23

申请号：US16215717

申请日：2018-12-11

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen ,  John Heanue ,  Momchil T. Mihnev

IPC: G02F1/01

Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.

公开(公告)号：US10222566B1

公开(公告)日：2019-03-05

申请号：US14991242

申请日：2016-01-08

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen

IPC: G02B6/42 ,  G02B6/30

Abstract: A photonic integrated circuit (PIC) coupled to a substrate may be aligned with receptacles having guide pin structures configured to receive guide pins attached to a fiber assembly. The receptacles may be affixed to a surface of the substrate and/or the PIC to permit the fiber assembly to be removed during a solder reflow process while maintaining the alignment of the fiber assembly to the PIC when reconnected following the solder reflow process.

公开(公告)号：US10133142B2

公开(公告)日：2018-11-20

申请号：US15472946

申请日：2017-03-29

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen ,  Ricardo Aroca

IPC: G02F1/035 ,  G02F1/225 ,  G02F1/025 ,  G02F1/21

Abstract: An optical Mach Zehnder modulator is described. The optical Mach Zehnder modulator may comprise a plurality of segments separated by curved waveguides. For example, an optical Mach Zehnder modulator may comprise a first waveguide arm having a first pn-junction formed therein, a second waveguide arm having a second pn-junction formed therein, a third waveguide arm coupled to the first waveguide arm via a first curved waveguide and a fourth waveguide arm coupled to the second waveguide arm via a second curved waveguide. The segments may have the same polarities. Alternatively, the segments may have opposite polarities. The different segments may be driven using different RF signals. The RF signals may be delayed from one another.

公开(公告)号：US09989787B2

公开(公告)日：2018-06-05

申请号：US15455917

申请日：2017-03-10

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr

IPC: G02F1/025 ,  G02F1/015

CPC classification number: G02F1/025 ,  G02F2001/0151

Abstract: Disclosed herein are methods, structures, and devices for a silicon carrier-depletion based modulator with enhanced doping in at least part of slab regions between waveguide core and contact areas. Compared to prior designs, this modulator exhibits lower optical absorption loss and better modulation bandwidth without sacrificing the modulation efficiency when operating at comparable bandwidth settings.