Abstract:
An electronic circuit module is housed in a thermally conductive housing having fluid conduits therein for carrying coolant. The circuit module includes a stack of a plurality of circuit boards supported in the housing, each circuit board having a thermally conductive member attached to opposite side portions thereof, each member having a sawtooth edge portion. A plurality of cooling bars are sandwiched between a wall of the housing and the side members of the stack, each bar including a surface adapted to abut the inner surface of the wall and a sawtooth portion for abutting the sawtooth portion of an individual circuit board. Torque means, such as a threaded fastener, is provided for moving the plurality of cooling bars to wedge the same between the individual members and the wall to establish good thermal connection between the coolant in the fluid conduits and the circuit boards.