Cooling apparatus for electronic modules
    120.
    发明授权
    Cooling apparatus for electronic modules 失效
    电子模块冷却装置

    公开(公告)号:US3904933A

    公开(公告)日:1975-09-09

    申请号:US51735174

    申请日:1974-10-23

    Inventor: DAVIS RONALD E

    CPC classification number: H05K7/20681 H05K7/1404 H05K7/20545

    Abstract: An electronic circuit module is housed in a thermally conductive housing having fluid conduits therein for carrying coolant. The circuit module includes a stack of a plurality of circuit boards supported in the housing, each circuit board having a thermally conductive member attached to opposite side portions thereof, each member having a sawtooth edge portion. A plurality of cooling bars are sandwiched between a wall of the housing and the side members of the stack, each bar including a surface adapted to abut the inner surface of the wall and a sawtooth portion for abutting the sawtooth portion of an individual circuit board. Torque means, such as a threaded fastener, is provided for moving the plurality of cooling bars to wedge the same between the individual members and the wall to establish good thermal connection between the coolant in the fluid conduits and the circuit boards.

    Abstract translation: 电子电路模块容纳在导热壳体中,其中具有用于承载冷却剂的流体导管。 电路模块包括支撑在壳体中的多个电路板的堆叠,每个电路板具有连接到其相对侧部的导热构件,每个构件具有锯齿边缘部分。 多个冷却棒被夹在壳体的壁和堆叠的侧部构件之间,每个杆包括适于邻接壁的内表面的表面和用于邻接单个电路板的锯齿形部分的锯齿形部分。 提供扭矩装置,例如螺纹紧固件,用于移动多个冷却杆,以将它们楔入各个构件和壁之间,以在流体导管和电路板之间的冷却剂之间建立良好的热连接。

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