公开(公告)号：US06624521B2

公开(公告)日：2003-09-23

申请号：US09910284

申请日：2001-07-20

申请人： Daniela Staiculescu ,  Joy Laskar

发明人： Daniela Staiculescu ,  Joy Laskar

IPC分类号： H01L2940

CPC分类号： H01L24/81 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/13144 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1903

摘要： A flip chip assembly is disclosed that includes a coplanar waveguide launch with a transmission line, and a bump interconnection that includes multiple ground bumps. The transmission line may be a radial transmission line. Similarly, the ground bumps may be arranged in a pseudo-coaxial configuration so as to effect a vertical transition in the flip chip assembly. A method is also disclosed that includes the steps of: providing a coplanar waveguide transmission line launch; providing a chip for attachment to the coplanar waveguide launch; arranging one or more ground bumps on the coplanar waveguide launch; and forming a bump interconnection between the coplanar waveguide launch and the chip. The coplanar waveguide launch provided in this method may include a radial transmission line. The step of arranging the multiple ground bumps may include the step of arranging multiple ground bumps in a pseudo-coaxial configuration.

摘要翻译： 公开了一种倒装芯片组件，其包括具有传输线的共面波导发射和包括多个接地凸块的凸块互连。 传输线可以是径向传输线。 类似地，接地凸块可以布置成伪同轴结构，以便在倒装芯片组件中实现垂直转变。 还公开了一种方法，其包括以下步骤：提供共面波导传输线发射; 提供用于附接到共面波导发射的芯片; 在共面波导发射上布置一个或多个接地突起; 并在共面波导发射和芯片之间形成凸块互连。 在该方法中提供的共面波导启动可以包括径向传输线。 布置多个接地凸块的步骤可以包括以伪同轴配置布置多个接地凸块的步骤。