公开(公告)号：US10373920B2

公开(公告)日：2019-08-06

申请号：US14183868

申请日：2014-02-19

Applicant: COMPOSECURE, LLC

Inventor： John Herslow

IPC: G06K19/077 ,  H01L21/56 ,  H01L23/00 ,  B32B37/12 ,  B32B38/06 ,  B42D25/41 ,  B42D25/328 ,  B42D25/425 ,  B42D25/435 ,  B32B7/12 ,  B32B15/04 ,  G06K19/06 ,  H01L23/498 ,  B42D25/373 ,  B42D25/47 ,  B32B38/10 ,  B32B38/00

Abstract: Composite cards formed in accordance with the invention include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be ‘lasered’ when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively. Alternatively, each card may be individually “lasered” to produce desired alpha numeric information, bar codes information or a graphic image, after the sheets are die-cut into cards.

公开(公告)号：US10275703B2

公开(公告)日：2019-04-30

申请号：US15887585

申请日：2018-02-02

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06F19/00 ,  G06K19/077 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q7/06 ,  G06K19/02

Abstract: RF shielding material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient RF shielding material is utilized to track and conform to the antenna.

公开(公告)号：US09390366B1

公开(公告)日：2016-07-12

申请号：US14793963

申请日：2015-07-08

Applicant: John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/06 ,  G06K19/077 ,  H01L25/00

CPC classification number: G06K19/07769 ,  H01L23/3121 ,  H01L2223/6677 ,  H01L2924/14 ,  H01L2924/15313

Abstract: A dual interface smart card having a metal layer includes an IC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.

Abstract translation: 具有金属层的双接口智能卡包括在金属层的顶表面和底表面之间安装在由无RF阻挡材料形成的插头上的触点和RF能力的IC模块。 插头提供对IC模块的支持和与金属层的电绝缘和隔离度。 所得到的卡可以具有接触和非接触操作能力以及除了IC模块的触点之外的完全平滑的外部金属表面。