公开(公告)号：US20210378150A1

公开(公告)日：2021-12-02

申请号：US16885105

申请日：2020-05-27

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06N3/08 ,  G06N3/04

Abstract: A cooling system for a datacenter is disclosed. The datacenter cooling system includes a refrigerant cooling loop to extract heat from a secondary cooling loop that is located within the datacenter or to provide supplemental cooling to one or more components of the datacenter that are coupled to the secondary cooling loop.

公开(公告)号：US20210368656A1

公开(公告)日：2021-11-25

申请号：US16879513

申请日：2020-05-20

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06N3/08 ,  G05B19/4155

Abstract: A cooling system for a datacenter is disclosed. The datacenter cooling system includes one or more flow controllers within a rack manifold, a server manifold, or server tray to facilitate movement of a coolant associated with a secondary cooling loop to cool a component within a server in response to the component monitoring its internal temperature.