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公开(公告)号：US11763976B2
公开(公告)日：2023-09-19
申请号：US16000492
申请日：2018-06-05
Applicant: ABB Power Electronics Inc.
Inventor： Ke Dai , Lanlan Yin , Tom Sun
IPC: H01F17/04 , H01F27/245 , H01F27/26 , H01F27/30 , H01F27/38 , H01F3/14 , H01F27/28 , H01F27/29 , H01F41/02 , H01F41/04
CPC classification number: H01F27/245 , H01F3/14 , H01F27/263 , H01F27/2804 , H01F27/29 , H01F27/306 , H01F27/38 , H01F41/0233 , H01F41/041 , H01F2027/2819
Abstract: An integrated magnetic core is provided. The integrated magnetic core includes a first plate and a second plate. The first plate includes a plurality of legs extending outwardly from a first surface of the first plate. The plurality of legs includes first and second oppositely disposed legs and third and fourth oppositely disposed legs. The second plate is coupled to at least the third and fourth legs of the first plate.
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公开(公告)号：US11664722B2
公开(公告)日：2023-05-30
申请号：US16705209
申请日：2019-12-05
Applicant: ABB Power Electronics Inc.
Inventor： Sanbao Zheng
CPC classification number: H02M1/4216 , H02M3/3353 , H02M7/06 , H02M1/0025
Abstract: Technologies for controlling AC-to-DC converters are disclosed. In one illustrative embodiment, a controller of an AC-to-DC converter measures two voltage levels of a split voltage bus of a power factor correction (PFC) circuit. The controller controls current drawn from the positive and negative terminals of the PFC circuit by a DC-to-DC converter. By controlling the current drawn from the two terminals, the controller can control the voltages on the terminals to be equal (but opposite).
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公开(公告)号：US11372060B2
公开(公告)日：2022-06-28
申请号：US16107456
申请日：2018-08-21
Applicant: ABB Power Electronics Inc.
Inventor： Jayesh Ranchhodbhai Patel , Gary Dean Kirkpatrick , Stanley Gene Kotwitz, Jr. , Roy Jaescentt Davis
Abstract: A power distribution busway joint monitoring sensor assembly is provided. A first sensor is configured to measure a first position temperature and generate a first signal indicative of the first position temperature, wherein the first position is proximate to a busway joint. A second sensor is configured to measure a second position temperature and generate a second signal indicative of the second position temperature. A sensor controller is configured to i) receive the first signal and the second signal, ii) process the first signal and the second signal, and iii) generate a processed first signal and a processed second signal. A system controller is configured to receive the processed first signal and the processed second signal and generate an alert when a temperature differential between the first position temperature and the second position temperature is greater than a predetermined threshold temperature.
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公开(公告)号：US11277900B2
公开(公告)日：2022-03-15
申请号：US17087822
申请日：2020-11-03
Applicant: ABB Power Electronics Inc.
Inventor： Robert Joseph Roessler , Anjana Shyamsundar
IPC: H05K1/02
Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side. The printed circuit board illustratively further includes a thermally conductive, electrically insulating additive resin filling spaces between the electrically conductive material in both the first and second patterned layers of each of the plurality of double-sided laminates, such that the electrically conductive material and the additive resin together form planar surfaces that contact the plurality of pre-preg sheets.
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公开(公告)号：US20210212210A1
公开(公告)日：2021-07-08
申请号：US17209591
申请日：2021-03-23
Applicant: ABB Power Electronics, Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.
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Patent Agency Ranking
公开(公告)号：US20210111632A1
公开(公告)日：2021-04-15
申请号：US17081071
申请日：2020-10-27
Applicant: ABB Power Electronics Inc.
Inventor： Yuxiang SHI , Liming LIU , Jing XU
IPC: H02M3/335
Abstract: According to one aspect of the present disclosure, a single-stage converter includes a rectifying circuit and a buck-boost circuit. The buck-boost circuit includes an inductor with a center tap configured to supply an output of the buck-boost circuit to the rectifying circuit. The buck-boost circuit also includes first and second interleaved arms arranged in parallel with a voltage input of the single-stage converter. The first and second interleaved arms are each coupled to the inductor and include a plurality of switches operable to control the output of the buck-boost circuit.
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公开(公告)号：US10932388B1
公开(公告)日：2021-02-23
申请号：US16745136
申请日：2020-01-16
Applicant: ABB Power Electronics Inc.
Inventor： Roy Davis , Jeremy Miles , Donald Rearick
Abstract: A modular edge power system is provided. The modular edge power system includes a housing having a rack adapted to mount compute devices and a direct current power bus within the housing. Multiple power distribution units are adapted to be removably coupled to the direct current power bus at a position within the housing and outside of the rack. Each power distribution unit is configured to distribute electrical power received from the direct current power bus to one or more compute devices mounted in the rack. Each power distribution unit may convert the electrical power from a first power level to a second power level.
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公开(公告)号：US10833591B2
公开(公告)日：2020-11-10
申请号：US15657786
申请日：2017-07-24
Applicant: ABB Power Electronics Inc.
Inventor： Arturo Silva , Loc Ngo , Richard Yeager , Jouni Uusitalo
Abstract: A power converter is provided. The power converter includes an input side having a first input winding and a second input winding coupled in electrical series to the first input winding. The power converter also includes an output side having a first output winding and a second output winding coupled in electrical parallel to the first output winding.
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公开(公告)号：US10826405B1
公开(公告)日：2020-11-03
申请号：US16428879
申请日：2019-05-31
Applicant: ABB Power Electronics Inc.
Inventor： Sandeep Bala , Liming Liu , Jing Xu
Abstract: According to an aspect of this disclosure, a circuit includes a voltage source and an output load, first and second resonant modules disposed between the voltage source and the output load, and first and second transformers. The circuit is further arranged such that the first transformer is disposed between the first resonant module and the output load, and the second transformer is disposed between the second resonant module and the output load. The circuit also includes a plurality of half-bridges coupled between the first and second resonant modules and the voltage source. The circuit further includes a voltage divider disposed between the voltage source and the plurality of half-bridges.
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公开(公告)号：US11439013B2
公开(公告)日：2022-09-06
申请号：US17209591
申请日：2021-03-23
Applicant: ABB Power Electronics, Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.
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