Method of making a multiconductor electrical connector arrangement
    11.
    发明授权
    Method of making a multiconductor electrical connector arrangement 失效
    制造多导体电连接器装置的方法

    公开(公告)号:US4665614A

    公开(公告)日:1987-05-19

    申请号:US801188

    申请日:1985-11-25

    IPC分类号: H01R43/00 H01R43/16

    摘要: Disclosed is a laminated multiconductor connector having a plurality of free standing metal terminals with oppositely facing nested surfaces and circuit board tails for electrically engaging the printed circuit board. Dielectric material is disposed between adjacent nesting surfaces of the terminal body in such a manner so as to insulate the nesting surfaces of adjacent terminals and to form a continuous mutually supported stacked array of terminals when mounted to the printed circuit board.Also disclosed is an intermediate subassembly and a related method of production the multiconductor connector.

    摘要翻译: 公开了一种层叠多导体连接器,其具有多个具有相对嵌套表面的独立的金属端子和用于电接合印刷电路板的电路板尾部。 绝缘材料以这样的方式设置在端子体的相邻嵌套表面之间,以便使相邻端子的嵌套表面绝缘,并且当安装到印刷电路板时形成连续相互支撑的堆叠的端子阵列。 还公开了一种中间子组件和相关的多导体连接器的制造方法。

    Laminated electrical connector arrangement
    12.
    发明授权
    Laminated electrical connector arrangement 失效
    层压电连接器布置

    公开(公告)号:US4577922A

    公开(公告)日:1986-03-25

    申请号:US719944

    申请日:1985-04-04

    CPC分类号: H01R12/58 Y10S439/933

    摘要: Disclosed is a laminated multiconductor connector having a plurality of free standing metal terminals with oppositely facing nested surfaces and circuit board tails for electrically engaging the printed circuit board. Dielectric material is disposed between adjacent nesting surfaces of the terminal body in such a manner so as to insulate the nesting surfaces of adjacent terminals and to form a continuous mutually supported stacked array of terminals when mounted to the printed circuit board.Also disclosed is an intermediate subassembly and a related method of production the multiconductor connector.

    摘要翻译: 公开了一种层叠多导体连接器,其具有多个具有相对嵌套表面的独立的金属端子和用于电接合印刷电路板的电路板尾部。 绝缘材料以这样的方式设置在端子体的相邻嵌套表面之间,以便使相邻端子的嵌套表面绝缘,并且当安装到印刷电路板时形成连续相互支撑的堆叠的端子阵列。 还公开了一种中间子组件和相关的多导体连接器的制造方法。