公开(公告)号：US5912024A

公开(公告)日：1999-06-15

申请号：US643661

申请日：1996-05-06

申请人： Mario A. Bolanos ,  Jeremias L. Libres ,  George A. Bednarz ,  Tay LiangChee ,  Julius Lim ,  Ireneus J. T. M. Pas

发明人： Mario A. Bolanos ,  Jeremias L. Libres ,  George A. Bednarz ,  Tay LiangChee ,  Julius Lim ,  Ireneus J. T. M. Pas

IPC分类号： B29C45/26 ,  B29C45/02 ,  B29C45/14 ,  B29C45/46 ,  B29C45/77 ,  B29K101/10 ,  B29L31/34 ,  H01L21/56

CPC分类号： B29C45/14655 ,  B29C45/463 ,  H01L21/565 ,  H01L2224/48091

摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The sproutless mold compound insert is packaged so that the mold compound will exit the packaging only where runners intersect the receptacle. The sproutless mold compound insert requires no alignment or cutting tools within the mold station. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.

摘要翻译： 一种用于封装集成电路管芯和引线框架组件的方法和装置。 将预先包装的无芽模具复合插入件71放置在底部模具追逐器81中的矩形插座91中。插座通过流道87连接到多个模具空腔85.引线框架组件包含引线框架，集成电路管芯和接合线 引线框架和模具放置在底部模具走沿81上方，使得集成电路模具均位于底部模具模腔85的上方。顶部模具追逐90放置在底部模具追逐器81和模具复合封装件71上。 顶模90具有对应于底模追逐81中的那些的模腔95.模具化合物插入件71优选地包装在具有热封边缘77的塑料膜75中。模具化合物被迫通过包装75并且热封 在模制过程中，通过由矩形柱塞101施加的压力来形成。77将无芽模具复合物插入物包装，使得模具化合物仅在运行时才离开包装 内部与插座相交。 无模具复合插入件不需要在模具台内对准或切割工具。 使用可变速度和压力施加柱塞以控制模具化合物填充顶部和底部模具中的空腔的速率，从而避免完成的包装中的空隙并且最小化集成电路组件的接合线的丝线扫掠。