公开(公告)号：US20090184418A1

公开(公告)日：2009-07-23

申请号：US12353317

申请日：2009-01-14

申请人： Ji-Hwan HWANG ,  Dong-Han Kim ,  Chul-Woo Kim ,  Chung-Ye Chung ,  Kwang-Jin Bae

发明人： Ji-Hwan HWANG ,  Dong-Han Kim ,  Chul-Woo Kim ,  Chung-Ye Chung ,  Kwang-Jin Bae

IPC分类号： H01L23/498 ,  H05K1/18

CPC分类号： H05K1/0277 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

摘要： A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip.

摘要翻译： 布线基板包括基膜，多个第一布线和多个第二布线。 基膜具有芯片安装区域，用于在其上安装半导体芯片。 第一布线沿芯片安装区域内的第一方向延伸到芯片安装区域的外部，并且包括沿与第一方向不同的第二方向延伸的第一连接端部。 第一连接端部可以形成在芯片安装区域的内部并且被配置为电连接到半导体芯片。 所述第二配线从所述芯片安装区域的内部朝向所述芯片安装区域的外侧沿所述第一方向延伸，并且包括沿与所述第一连接端部延伸的所述第二方向相反的方向延伸的第二连接端部， 连接端部可以形成在芯片安装区域内部，并且被配置为电连接到半导体芯片。