公开(公告)号：US07381293B2

公开(公告)日：2008-06-03

申请号：US10340185

申请日：2003-01-09

申请人： Ming-Yi Wang ,  Jeng-Yen Tsai ,  Jeng-Chiang Chuang ,  Chon-Yai Tasi

发明人： Ming-Yi Wang ,  Jeng-Yen Tsai ,  Jeng-Chiang Chuang ,  Chon-Yai Tasi

IPC分类号： H01L21/00 ,  C23C16/00

CPC分类号： H01L21/67069 ,  Y10S156/915 ,  Y10T279/23

摘要： A new and improved insert ring for a wafer support inside a processing chamber for the processing, particularly dry etching, of semiconductor wafer substrates. The insert ring includes a generally convex inner surface which faces the wafer support and defines a gap or berline wall between the insert ring and the wafer support. In one embodiment, the convex inner surface is convexly-tapered. In another embodiment, the convex inner surface is convexly-curved. Throughout etching of multiple successive substrates on the wafer support, accumulations of polymer material on the inner surface of the insert ring are prevented or at least substantially reduced. Consequently, polymer peeling is eliminated or reduced and operational intervals for the processing chamber or system between periodic maintenance or cleanings, are prolonged.

摘要翻译： 一种用于晶片支撑件的新的改进的插入环，用于处理室，用于半导体晶片衬底的特别干蚀刻。 插入环包括面向晶片支撑件的大致凸形的内表面，并且在插入环和晶片支撑件之间限定间隙或边缘壁。 在一个实施例中，凸形内表面是凸出的。 在另一个实施例中，凸形内表面是凸曲面的。 在晶片支撑件上的多个连续衬底的整个蚀刻过程中，防止或至少大大减少了在插入环的内表面上积聚聚合物材料。 因此，聚合物剥离被消除或减少，并且延长了定期维护或清洁之间的处理室或系统的操作间隔。