公开(公告)号：US06815653B2

公开(公告)日：2004-11-09

申请号：US10122687

申请日：2002-04-15

Applicant: Jenq-Yann Tsay ,  Jeng-Chiang Chuang ,  Chih-Pen Yen ,  Yung-Mao Hsu

Inventor： Jenq-Yann Tsay ,  Jeng-Chiang Chuang ,  Chih-Pen Yen ,  Yung-Mao Hsu

IPC: H01L21306

CPC classification number: H01J37/32431 ,  C23C16/4401 ,  G01J3/443 ,  G01N21/55 ,  G01N2021/8411 ,  G01N2021/8427 ,  H01J2237/0225

Abstract: A method and apparatus for detecting material accretion and peeling in a system such as a plasma process chamber, including multiple optical sensors which are provided in the chamber above a gas distribution plate or other surface inside the chamber. The optical sensors are connected to a central process controller that is capable of terminating operation of the chamber and may be equipped with an alarm. In the event that the optical sensors detect asymmetries in brightness or light reflection among various portions or regions of the gas distribution plate or other surface, which asymmetries may indicate the formation of a material coating on the plate or dislodging of contaminant particles from the plate, a signal is sent to the process controller, which may be adapted to terminate the plasma process, alert operating personnel, or both.

Abstract translation: 一种用于检测诸如等离子体处理室的系统中的材料吸积和剥离的方法和装置，包括设置在气室内的气体分配板或室内的其他表面上的多个光学传感器。 光学传感器连接到能够终止腔室操作的中央过程控制器，并且可以配备有报警器。 在光学传感器检测气体分布板或其他表面的各个部分或区域之间的亮度或光反射不对称性的情况下，这种不对称性可指示板上的材料涂层的形成或从板上移除污染物颗粒， 信号被发送到过程控制器，其可以适于终止等离子体处理，警报操作人员或两者。

公开(公告)号：US07381293B2

公开(公告)日：2008-06-03

申请号：US10340185

申请日：2003-01-09

Applicant: Ming-Yi Wang ,  Jeng-Yen Tsai ,  Jeng-Chiang Chuang ,  Chon-Yai Tasi

Inventor： Ming-Yi Wang ,  Jeng-Yen Tsai ,  Jeng-Chiang Chuang ,  Chon-Yai Tasi

IPC: H01L21/00 ,  C23C16/00

CPC classification number: H01L21/67069 ,  Y10S156/915 ,  Y10T279/23

Abstract: A new and improved insert ring for a wafer support inside a processing chamber for the processing, particularly dry etching, of semiconductor wafer substrates. The insert ring includes a generally convex inner surface which faces the wafer support and defines a gap or berline wall between the insert ring and the wafer support. In one embodiment, the convex inner surface is convexly-tapered. In another embodiment, the convex inner surface is convexly-curved. Throughout etching of multiple successive substrates on the wafer support, accumulations of polymer material on the inner surface of the insert ring are prevented or at least substantially reduced. Consequently, polymer peeling is eliminated or reduced and operational intervals for the processing chamber or system between periodic maintenance or cleanings, are prolonged.

Abstract translation: 一种用于晶片支撑件的新的改进的插入环，用于处理室，用于半导体晶片衬底的特别干蚀刻。 插入环包括面向晶片支撑件的大致凸形的内表面，并且在插入环和晶片支撑件之间限定间隙或边缘壁。 在一个实施例中，凸形内表面是凸出的。 在另一个实施例中，凸形内表面是凸曲面的。 在晶片支撑件上的多个连续衬底的整个蚀刻过程中，防止或至少大大减少了在插入环的内表面上积聚聚合物材料。 因此，聚合物剥离被消除或减少，并且延长了定期维护或清洁之间的处理室或系统的操作间隔。

公开(公告)号：US07354555B2

公开(公告)日：2008-04-08

申请号：US10141566

申请日：2002-05-08

Applicant: Chih-Pen Yen ,  Jeng-Yann Tsay ,  Jeng-Chiang Chuang ,  Cheng-Fang Lin ,  Yung-Mao Hsu

Inventor： Chih-Pen Yen ,  Jeng-Yann Tsay ,  Jeng-Chiang Chuang ,  Cheng-Fang Lin ,  Yung-Mao Hsu

IPC: B32B5/02 ,  B32B27/04

CPC classification number: G05D7/0658

Abstract: A system for controlling the flow of gases into a reaction chamber used in processing semiconductor devices includes a safety interlock feature that prevents inadvertent mixing of incompatible, reactive gases. The interlock feature is implemented in an interlock control circuit which operates a valve system for individually controlling the flow of separate gases into the chamber. The interlock circuit includes a series of relay switches and timers arranged to create a time delay between the initiation of flow of gases from separate sources into the chamber.

Abstract translation: 用于控制进入用于处理半导体器件的反应室中的气体流的系统包括防止不相容的反应性气体的无意混合的安全互锁特征。 互锁特征在互锁控制电路中实现，该互锁控制电路操作一个阀门系统，用于单独控制分离气体进入腔室的流量。 互锁电路包括一系列继电器开关和定时器，其布置成在从单独的源流入腔室的气体的开始流动之间产生时间延迟。

公开(公告)号：US06733621B2

公开(公告)日：2004-05-11

申请号：US10141544

申请日：2002-05-08

Applicant: Jeng-Chiang Chuang

Inventor： Jeng-Chiang Chuang

IPC: H01L21306

CPC classification number: H01J37/32834 ,  H01J37/3244

Abstract: A method and apparatus comprising a purge conduit and vent conduit attached to a turbo pump of a plasma etch chamber. The purge conduit may communicate with atmospheric air or with a nitrogen source or clean, dry air (CDA) source, and the vent conduit is fitted with a manual valve, an electric valve, or both, along with a flow restrictor and an end cap provided with an air or gas vent. The air flow restrictor facilitates gradual, rather than rapid, escape of air or gas from the chamber, through the turbo pump and from the vent conduit upon opening a gate valve between the chamber and the turbo, to prevent damage to the internal turbo pump components.

Abstract translation: 一种方法和装置，包括连接到等离子体蚀刻室的涡轮泵的净化导管和排气导管。 吹扫管道可与大气或与氮气源或干净空气（CDA）源连通，并且排气管道与手动阀，电动阀或两者一起配备有限流器和端盖 配有空气或气体通风口。 空气流量限制器有助于逐渐而不是快速地从室中逸出空气或气体，通过涡轮泵和从通气管道打开腔室和涡轮之间的闸阀，以防止损坏内部涡轮泵部件 。