Non-contact testing of printed electronics
    11.
    发明授权
    Non-contact testing of printed electronics 有权
    印刷电子学非接触式测试

    公开(公告)号:US08378702B2

    公开(公告)日:2013-02-19

    申请号:US12437779

    申请日:2009-05-08

    CPC classification number: G01R31/309 G01R31/2808 G01R31/2812 G01R31/304

    Abstract: Apparatus and methods for non-contact testing of electronic components printed on a substrate (3) are provided. Test circuits (11) are printed on the substrate (3) at the same time as the desired electronic component. The test circuits (11) are all optical and include a first portion (13) for providing electrical energy for the test circuit (11) and a second portion (15) for generating a detectable optical signal that is indicative of at least one electrical property of the electronic component. The test circuits are used in real time and minimize the production of unusable scrap in the printing of such products as ePaper.

    Abstract translation: 提供了印刷在基板(3)上的电子部件的非接触测试的装置和方法。 测试电路(11)与期望的电子部件同时印刷在基板(3)上。 测试电路(11)都是光学的,并且包括用于为测试电路(11)提供电能的第一部分(13)和用于产生可检测光信号的第二部分(15),该第二部分指示至少一个电气特性 的电子元件。 测试电路实时使用,并在打印诸如ePaper的产品中最小化不可用废料的生产。

    Passive alignment member for vertical surface emitting/detecting device
    12.
    发明授权
    Passive alignment member for vertical surface emitting/detecting device 失效
    用于垂直表面发射/检测装置的被动对准构件

    公开(公告)号:US6085007A

    公开(公告)日:2000-07-04

    申请号:US31592

    申请日:1998-02-27

    CPC classification number: G02B6/4231 G02B6/4246 G02B6/4249

    Abstract: Passive alignment members for surface emitting and detecting optoelectronic devices having a silicon substrate with a front surface and a back surface and a selected thickness therebetween; side surfaces with holes having vertical registration surfaces etched therein for receiving alignment pins; and at least one optoelectronic device disposed on the front surface, the device being aligned to the hole.

    Abstract translation: 用于表面发射和检测光电子器件的无源对准构件,其具有具有前表面和后表面的硅衬底和其间的选定厚度; 具有蚀刻在其中的具有垂直对准表面的孔的侧表面用于接收对准销; 以及设置在所述前表面上的至少一个光电子器件,所述器件与所述孔对准。

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