Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods
    18.
    发明授权
    Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods 有权
    用于固态发光装置的多路热封包装及相关组装方法

    公开(公告)号:US07625103B2

    公开(公告)日:2009-12-01

    申请号:US11408767

    申请日:2006-04-21

    IPC分类号: F21V29/00

    摘要: A mounting substrate includes a peripheral portion and a central portion. Solid state light emitting elements are provided on the mounting substrate. A housing is configured to thermally couple to the peripheral portion of the mounting substrate, so as to provide a first thermal conduction path for at least some heat generated by the solid state light emitting elements. A thermal conduction member is configured to thermally couple the central portion of the mounting substrate to the housing, so as to provide a second thermal conduction path that is different from the first thermal conduction path, for at least some heat generated by the solid state light emitting elements. Related assembling methods are also described.

    摘要翻译: 安装基板包括周边部分和中心部分。 固态发光元件设置在安装基板上。 壳体被配置为热耦合到安装基板的周边部分,以便为由固态发光元件产生的至少一些热量提供第一热传导路径。 导热构件被配置为将安装基板的中心部分热耦合到壳体,以便提供与第一热传导路径不同的第二导热路径,用于由固态光产生的至少一些热 发光元件。 还描述了相关的组装方法。