公开(公告)号：US12130000B2

公开(公告)日：2024-10-29

申请号：US18197104

申请日：2023-05-15

申请人： Exposure Illumination Architects, Inc.

发明人： Daniel S. Spiro

IPC分类号： F21V29/74 ,  F21K9/27 ,  F21V15/01 ,  F21V23/00 ,  F21V23/04 ,  F21V29/70 ,  F21V29/77 ,  H05B45/20 ,  H05B47/125 ,  F21V5/04 ,  F21Y103/10 ,  F21Y113/10 ,  F21Y115/10 ,  H01L33/64

CPC分类号： F21V29/74 ,  F21K9/27 ,  F21V15/01 ,  F21V23/003 ,  F21V23/0478 ,  F21V29/70 ,  F21V29/773 ,  H05B45/20 ,  H05B47/125 ,  F21V5/04 ,  F21Y2103/10 ,  F21Y2113/10 ,  F21Y2115/10 ,  H01L33/642

摘要： An elongated modular heat sink array having through power and/or data flowing from end to end powering and/or communicating with externally mounted coupled electronic devices.

公开(公告)号：US20240355993A1

公开(公告)日：2024-10-24

申请号：US18759835

申请日：2024-06-29

申请人： Xiamen Extremely PQ Display Technology Co., Ltd.

发明人： GANG MA

IPC分类号： H01L33/64 ,  H01L33/00 ,  H01L33/62

CPC分类号： H01L33/644 ,  H01L33/005 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2933/0075

摘要： A light-emitting device includes: a substrate that includes a first surface and a second surface and defines a through via; a light-emitting element disposed on the first surface of the substrate and disposed corresponding to the through via in the substrate; and a heat-conducting structure filled with the through via in the substrate. Moreover, an end of the heat-conducting structure extends from the through via to be tightly attached to the light-emitting element, and another end of the heat-conducting structure extends from the through via to be flush with the second surface of the substrate or to cover the second surface of the substrate. Therefore, the light-emitting device can conduct heat, generated during the light-emitting element works, by means of the heat-conducting structure disposed in the substrate below the light-emitting element, so that the heat dissipation efficiency of the light-emitting device is improved.

公开(公告)号：US20240332477A1

公开(公告)日：2024-10-03

申请号：US18435504

申请日：2024-02-07

申请人： LG Display Co., Ltd.

发明人： JeongJo LEE ,  HanSeok KIM ,  TaeYoung JUNG

IPC分类号： H01L33/64 ,  H01L25/16 ,  H05K7/20

CPC分类号： H01L33/642 ,  H01L25/167 ,  H01L33/648 ,  H05K7/2099

摘要： The present disclosure relates to a display apparatus. A display apparatus according to an embodiment of the present disclosure includes a display panel configured to display images, a heat dissipation member disposed on one side of the display panel, and a printed circuit board disposed on one side of the heat dissipation member. The heat dissipation member includes a first portion overlapping the printed circuit board, and a second portion disposed in an area spaced apart from the printed circuit board at a certain interval.

公开(公告)号：US20240322106A1

公开(公告)日：2024-09-26

申请号：US18613120

申请日：2024-03-22

申请人： Coretronic Corporation

发明人： SHAO-PENG SU

IPC分类号： H01L33/64 ,  H01L23/38

CPC分类号： H01L33/645 ,  H01L23/38 ,  H01L33/642

摘要： A heat dissipation module includes an airtight structure and a thermoelectric cooling element. The airtight structure includes a first workpiece, a second workpiece and a compressible element. The first workpiece has a first airtight portion having a plurality of first protrusions. The second workpiece configured in alignment with the first workpiece has a second airtight portion having a plurality of second protrusions. The compressible element is configured between the first airtight portion and the second airtight portion, wherein a part of the compressible element is located in gaps of the first protrusions and gaps of the second protrusions. The thermoelectric cooling element configured between the first workpiece and the second workpiece partially contacts the first workpiece, wherein the heating element is configured on a side of the first workpiece away from the thermoelectric cooling element.

公开(公告)号：US20240322103A1

公开(公告)日：2024-09-26

申请号：US18679303

申请日：2024-05-30

申请人： SEOUL SEMICONDUCTOR CO., LTD.

发明人： Se Min BANG

IPC分类号： H01L33/62 ,  H01L33/50 ,  H01L33/56 ,  H01L33/64

CPC分类号： H01L33/62 ,  H01L33/502 ,  H01L33/56 ,  H01L33/642

摘要： A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.

公开(公告)号：US20240250231A1

公开(公告)日：2024-07-25

申请号：US18562372

申请日：2022-05-18

申请人： CORNING INCORPORATED

发明人： SEAN MATTHEW GARNER ,  DAVID ROBERT HEINE ,  DEAN MICHAEL THELEN

IPC分类号： H01L33/64 ,  H01L25/075

CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L2933/0075

摘要： Apparatuses and methods are described for substrate materials and designs for controlling heat dissipation from semiconductor devices such as light-emitting diodes (LEDs). The embodiments may reduce temperature increases of semiconductor devices during operation. In some examples, a substrate structure is manufactured with a plurality of fins positioned along a first side. A plurality of heating sources, such as electronic components that generate heat, may be positioned along a second side of the substrate structure. The plurality of heat sources may be positioned to be laterally offset from the plurality of fins. In some examples, a plurality of LEDs are positioned along the first side of the substrate structure and at least partially laterally in line with the plurality of fins. In some examples, the plurality of LEDs are positioned along the first side of the substrate structure and laterally offset from the plurality of fins.

公开(公告)号：US20240172542A1

公开(公告)日：2024-05-23

申请号：US17756587

申请日：2022-05-13

申请人： WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.

发明人： Wenqiang WANG

IPC分类号： H10K59/80 ,  H01L33/64 ,  H10K102/00

CPC分类号： H10K59/8794 ,  H01L33/642 ,  H10K2102/311

摘要： A supporting component and a display device are provided. The supporting component is configured to support the display panel. The supporting component includes a hole. The supporting component includes a first support portion and a second support portion. The first support portion is arranged around the hole. The second support portion is arranged around the first support portion. An elasticity modulus of the second support portion is greater than an elasticity modulus of the first support portion.

公开(公告)号：US20240162393A1

公开(公告)日：2024-05-16

申请号：US18504699

申请日：2023-11-08

申请人： SEOUL SEMICONDUCTOR CO., LTD.

发明人： Miso KO ,  Hee Jeong BAN ,  Eunmi CHOI

IPC分类号： H01L33/50 ,  H01L33/64

CPC分类号： H01L33/505 ,  H01L33/642

摘要： A light source module according to the present invention includes a light emitting diode package, which includes a substrate, a first upper electrode and a second upper electrode disposed on an upper surface of the substrate, a light emitting structure disposed on an upper surface of the first upper electrode and electrically connected to the first and second upper electrodes, and a wavelength conversion portion disposed corresponding to a light emitting region on an upper surface of the light emitting structure, a first lower electrode and a second lower electrode disposed on a lower surface of the substrate and electrically connected to the first and second upper electrodes, respectively, and a heat dissipation pad disposed on a lower surface of the substrate to be spaced apart from the first and second lower electrodes.

公开(公告)号：US11916166B2

公开(公告)日：2024-02-27

申请号：US17053805

申请日：2019-05-08

申请人： Osram OLED GmbH

发明人： Roland Heinrich Enzmann ,  Christian Mueller ,  Stefan Barthel ,  Vanessa Eichinger ,  Marc Christian Nenstiel ,  Lorenzo Zini

IPC分类号： H01L33/14 ,  H01L25/16 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62 ,  H01L33/64

CPC分类号： H01L33/14 ,  H01L25/167 ,  H01L33/005 ,  H01L33/382 ,  H01L33/62 ,  H01L33/642 ,  H01L2933/0016 ,  H01L2933/0066

摘要： An optoelectronic device may include an optoelectronic semiconductor chip that is configured to emit electromagnetic radiation. The chip may include a first semiconductor layer, a second semiconductor layer, first and second current spreading structures, and a plurality of electrical contact elements. The first current spreading layer may be arranged on a side of the second semiconductor layer facing away from the first semiconductor layer. The plurality of electrical contact elements may electrically connect the first semiconductor layer to the first current spreading layer. The second current spreading layer may be electrically connected to the second semiconductor layer. The second current spreading layer may be arranged between the first current spreading layer and the second semiconductor layer where an insulating layer insulates a first electrical contact element and a second electrical contact element from the second current spreading layer.

公开(公告)号：US20230411581A1

公开(公告)日：2023-12-21

申请号：US18459763

申请日：2023-09-01

申请人： ROHM CO., LTD.

发明人： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/64 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

CPC分类号： H01L33/62 ,  H01L23/49541 ,  H01L23/4951 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L23/49575 ,  H01L23/49517 ,  H01L33/52 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L33/64 ,  H01L23/49568 ,  H01L33/483 ,  H01L33/54 ,  H01L23/48 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49548 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L25/167

摘要： A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.