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公开(公告)号：US20250106804A1
公开(公告)日：2025-03-27
申请号：US18930580
申请日：2024-10-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sidhant JAIN , Lalith KUMAR , Aman AGARWAL , Dinesh Rooparam CHOUDHARY , Varini GUPTA
Abstract: A method performed by a user equipment (UE) for signaling using satellite access in a 4th generation (4G) or 5th generation (5G) network is provided. The method includes receiving, by the UE, a signal from a first network apparatus associated with a satellite when a feeder link is available between the first network apparatus and the second network apparatus associated with a ground network, storing, by the UE, the signal received from the first network apparatus, and determining, by the UE, a third network apparatus associated with the satellite to transmit a response signaling to a user equipment (UE) upon receiving the signal using the first network apparatus based on an expected location of the UE.
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公开(公告)号：US20250106739A1
公开(公告)日：2025-03-27
申请号：US18898339
申请日：2024-09-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungjoo SUH
Abstract: Provided is a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data rate. A method performed by a user equipment may include transmitting a registration request message to an access and mobility management function (AMF), receiving a registration accept message from the AMF, transmitting a protocol data unit (PDU) session establishment request message to a session management function (SMF), receiving a PDU session establishment accept message from the SMF, and receiving a configuration update message from the AMF.
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13.发明申请公开(公告)号：US20250106712A1
公开(公告)日：2025-03-27
申请号：US18742143
申请日：2024-06-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Donggun KIM
IPC: H04W36/04
Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transmission rate. A method performed by a user equipment (UE) in a communication system is provided. The method includes receiving a radio resource control (RRC) message including a configuration of layer 1 (L1)/layer 2 (L2) triggered mobility (LTM) associated with a LTM cell switch procedure identifying that the LTM cell switch procedure is triggered, and releasing current dedicated radio configuration associated with a cell group for which the LTM cell switch procedure is triggered, wherein, in case that the LTM cell switch procedure is triggered on a master cell group (MCG), the current dedicated radio configuration is released except for an MCG cell-radio network temporary identifier (C-RNTI).
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公开(公告)号：US20250106626A1
公开(公告)日：2025-03-27
申请号：US18832390
申请日：2023-01-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Rajavelsamy RAJADURAI , Nivedya Parambath SASI , Rohini RAJENDRAN
Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. Embodiments herein disclose a method and system for authentication method selection in an edge network system. The method includes determining whether the UE is configured with authentication methods supported by at least one of an ECS, an EES, a home network and a serving network in the edge network system. The method further includes selecting the authentication methods configured at the UE based on a capability of the UE to establish a connection with the EES based on the at least one selected authentication method when the UE is configured with the authentication methods supported by at least one of the ECS, the EES, the home network and the serving network.
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公开(公告)号：US20250106274A1
公开(公告)日：2025-03-27
申请号：US18974224
申请日：2024-12-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Juyeon JIN , Hyeeoncho Gi , Doosuk Kang , Gupil Cheong
Abstract: A method by an electronic device, includes: establishing a communication connection configured to use a first codec and a first modulation scheme for an audio service with an external electronic device; determining to use a second codec for reproducing a media file; transmitting, to the external electronic device, a first configuration message indicating the use of the second codec; after transmitting the first configuration message, receiving, from the external electronic device, a first change request message for a change from the first modulation scheme to a second modulation scheme; and transmitting, to the external electronic device, at least one audio packet generated using the second codec by using the second modulation scheme.
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Patent Agency Ranking
公开(公告)号：US20250105975A1
公开(公告)日：2025-03-27
申请号：US18883311
申请日：2024-09-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngbum KIM , Cheolkyu SHIN , Heedon GHA , Taehan BAE
Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. A user equipment (UE) includes transceiver, and a controller coupled to the transceiver, and configured to receive, from a base station, first information configuring sidelink positioning reference signal (SL PRS) resources in a shared resource pool, receive, from the base station, second information configuring phase tracking reference signal (PTRS) resources, and transmit, to the base station, a PTRS on a PTRS resource which is not overlapped with an SL PRS resource, wherein the shared resource pool is for the SL PRS resources and physical sidelink shared channel (PSSCH) resources.
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公开(公告)号：US20250105650A1
公开(公告)日：2025-03-27
申请号：US18970275
申请日：2024-12-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaedeok CHA
Abstract: This electronic device may comprise: a charging circuit configured to supply power to a battery, wherein: the charging circuit comprises: a first buck circuit including a first switching element and a second switching element, a second buck circuit including a third switching element and a fourth switching element, and a boost circuit including a fifth switching element and a sixth switching element, each of the switching elements including a switch; an input voltage is applied to an input node of the first switching element and an input node of the third switching element; one end of a first inductor is connected to a first connection node between the first switching element and the second switching element of the first buck circuit; one end of a second inductor is connected to a second connection node between the third switching element and the fourth switching element of the second buck circuit; an other end of the first inductor and an other end of the second inductor are connected to a third connection node between the fifth switching element and the sixth switching element of the boost circuit; and the fifth switching element is connected in parallel to the battery and a capacitor.
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公开(公告)号：US20250105493A1
公开(公告)日：2025-03-27
申请号：US18896063
申请日：2024-09-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunyoung ROH , Jeong PARK
Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may include: a housing including a side wall, wherein the side wall includes a recess recessed from an outer surface of the side wall; a non-conductive cap disposed in the recess and including a protruding portion passing through the recess; an antenna module disposed opposite to the cap with respect to the recess and including at least one antenna element disposed to face the recess; and a bracket disposed inside the housing such that the antenna module is mounted thereon and including a coupling hole through which the protruding portion is inserted.
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公开(公告)号：US20250105201A1
公开(公告)日：2025-03-27
申请号：US18741372
申请日：2024-06-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Younghun KIM
IPC: H01L23/00 , H01L23/31 , H01L23/498
Abstract: A semiconductor package includes a package substrate including a package substrate comprising a base layer and a connection pad disposed on an upper surface of the base layer; a semiconductor chip disposed on the package substrate and the semiconductor chip comprises a semiconductor substrate and a bonding pad disposed on an upper surface of the semiconductor substrate; a bonding wire in contact with the connection pad and the bonding pad; a first dam structure disposed on the package substrate and arranged between the connection pad and the bonding pad; a non-conductive filler disposed on the package substrate surrounding the first dam structure and the bonding wire; and a mold layer disposed on the package substrate covering a portion of an upper surface of the package substrate and surrounding the semiconductor chip and the non-conductive filler.
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公开(公告)号：US20250105193A1
公开(公告)日：2025-03-27
申请号：US18890118
申请日：2024-09-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jungmin Ko , Hyunhee Lee , Hojun Lee , Dongjoo Choi
IPC: H01L23/00 , H01L23/498 , H01L25/065 , H10B80/00
Abstract: A semiconductor package includes a first semiconductor chip including a first through-via and a first upper pad, a second semiconductor chip provided on the first semiconductor chip and including a second lower pad, and a bonding bump provided between the first semiconductor chip and the second semiconductor chip and connected to the first upper pad and the second lower pad. The bonding bump includes: a conductive pattern directly contacting the second lower pad and including nickel and a bonding structure directly contacting the conductive pattern and the first upper pad, wherein the bonding structure includes an intermetallic compound including copper and a solder material. A thickness of the bonding structure is from about 47% to about 54% of a sum of a thickness of the conductive pattern, a thickness of the bonding structure, and a thickness of the first upper pad.
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