公开(公告)号：US20050037593A1

公开(公告)日：2005-02-17

申请号：US10850040

申请日：2004-05-20

Applicant: Philippe Delpech ,  Christophe Regnier ,  Sebastien Cremer ,  Stephane Monfray

Inventor： Philippe Delpech ,  Christophe Regnier ,  Sebastien Cremer ,  Stephane Monfray

IPC: H01L21/02 ,  H01L21/336 ,  H01L21/762 ,  H01L29/786 ,  H01L21/76

CPC classification number: H01L28/40 ,  H01L21/76264 ,  H01L29/66772 ,  H01L29/78648

Abstract: A process for producing an integrated electronic circuit comprises the production of a first electronic component and a second electronic component that are superposed on top of a substrate. A volume of temporary material is formed on the substrate at the position of the second electronic component. The first electronic component is then produced above the volume of temporary material relative to the substrate, and then the second electronic component is produced using at least one shaft for access to the temporary material. The first electronic component may be an active component and the second electronic component may be a passive component.

Abstract translation: 一种用于制造集成电子电路的方法包括制造叠置在基板顶部上的第一电子部件和第二电子部件。 在第二电子部件的位置处，在基板上形成一定量的临时材料。 然后在临时材料的体积上方相对于基板制造第一电子部件，然后使用至少一个轴来制造第二电子部件，用于接近临时材料。 第一电子部件可以是有源部件，第二电子部件可以是无源部件。