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11.
公开(公告)号:US20210190856A1
公开(公告)日:2021-06-24
申请号:US17104749
申请日:2020-11-25
Applicant: ADVANTEST Corporation
Inventor: Natsuki Shiota , Aritomo Kikuchi
Abstract: An electronic component handling apparatus includes: a thermostatic chamber in which a socket disposed, the socket electrically being connectable to a device under test (DUT) including a first antenna; a moving device that moves the DUT and presses the DUT against the socket; an anechoic chamber disposed adjacent to the thermostatic chamber; a second antenna disposed inside the thermostatic chamber; and a first window that transmits radio waves radiated from the first or second antenna. The thermostatic chamber has a first opening on a wall surface of the thermostatic chamber. The anechoic chamber has a radio wave absorber and a second opening that opens toward a transmission direction of the radio waves from or to the second antenna. The thermostatic chamber and the anechoic chamber are connected to each other to make the first opening and the second opening face each other.
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公开(公告)号:US20200300890A1
公开(公告)日:2020-09-24
申请号:US16742982
申请日:2020-01-15
Applicant: ADVANTEST Corporation
Inventor: Takashi Kawashima , Akihiko Ito , Keishi Oku , Natsuki Shiota
IPC: G01R1/04 , H01L23/00 , H01L23/498 , G01R31/28
Abstract: The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L2 of the second contact probe 22 is shorter than the length L1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.
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