公开(公告)号：US10271428B2

公开(公告)日：2019-04-23

申请号：US15926014

申请日：2018-03-20

Applicant: AGC Inc.

Inventor： Tomoya Hosoda ,  Toru Sasaki ,  Nobutaka Kidera ,  Tatsuya Terada

IPC: H01K3/10 ,  H05K1/03 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46 ,  H05K3/00 ,  H05K3/38

Abstract: To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate, which comprises forming a hole in a laminate comprising a first conductor layer, a layer (A) which is made of a fluororesin material containing a melt-moldable fluororesin having specific functional groups and a reinforcing fiber substrate and which has a dielectric constant from 2.0 to 3.5, a second conductor layer, an adhesive layer and a layer (B) made of a cured product of a thermosetting resin laminated in this order, applying, to an inner wall surface of the hole, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer.