公开(公告)号：US10453733B2

公开(公告)日：2019-10-22

申请号：US15905400

申请日：2018-02-26

Applicant: Applied Materials, Inc.

Inventor： Masato Ishii ,  Mehmet Tugrul Samir ,  Shu-Kwan Lau ,  Jeffrey Tobin

IPC: H01L21/687 ,  C23C16/458 ,  C30B25/12 ,  H01L21/67 ,  H01L21/677 ,  C30B35/00

Abstract: In one embodiment, a substrate support assembly includes a susceptor for supporting a substrate, and a supporting transfer mechanism coupled to the susceptor, the supporting transfer mechanism having a surface for supporting a peripheral edge of the substrate, the supporting transfer mechanism being movable relative to an upper surface of the susceptor.