公开(公告)号：US11088054B2

公开(公告)日：2021-08-10

申请号：US16570841

申请日：2019-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ying-Chung Chen ,  Hui-Chung Liu

IPC: H01L21/48 ,  H01L23/495

Abstract: A lead frame includes a die pad having a pad top surface and a pad bottom surface opposite to the top pad surface, a plurality of leads, each having a top lead surface and a bottom lead surface opposite to the top lead surface and disposed around the die pad, and a first molding compound disposed between the die pad and each of the leads. The first molding compound exposes the top pad surface of the die pad by covering a portion of the periphery of the top pad surface of the die pad. A method for manufacturing the lead frame is also disclosed.

公开(公告)号：US10373883B2

公开(公告)日：2019-08-06

申请号：US15795203

申请日：2017-10-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An Fang ,  Chi Sheng Tseng

IPC: H01L29/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/053 ,  H01L23/34 ,  H01L21/48 ,  H01L33/48 ,  H01L33/62 ,  H01L31/0203 ,  H01L31/024 ,  H01L31/02 ,  H01L23/13 ,  H01L25/16 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package device comprises a substrate, an electronic component and a protection layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a first opening penetrating the substrate. The electronic component is disposed on the first surface of the substrate. The protection layer is disposed on the second surface of the substrate. The protection layer has a first portion adjacent to the first opening and a second portion disposed farther away from the first opening than is the first portion of the protection layer. The first portion of the protection layer has a surface facing away from the second surface of the substrate. The second portion of the protection layer has a surface facing away from the second surface of the substrate. A distance between the surface of the first portion of the protection layer and the second surface of the substrate is greater than a distance between the surface of the second portion of the protection layer and the second surface of the substrate.