公开(公告)号：US10770369B2

公开(公告)日：2020-09-08

申请号：US16112248

申请日：2018-08-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Pin Hung ,  Tang-Yuan Chen ,  Jin-Feng Yang ,  Meng-Kai Shih

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a heat dissipation lid and a thermal isolation. The substrate has a surface. The first electronic component and the second electronic component are over the surface of the substrate and arranged along a direction substantially parallel to the surface. The first electronic component and the second electronic component are separated by a space therebetween. The heat dissipation lid is over the first electronic component and the second electronic component. The heat dissipation lid defines one or more apertures at least over the space between the first electronic component and the second electronic component. The thermal isolation is in the one or more apertures of the heat dissipation lid.