公开(公告)号：US20190393140A1

公开(公告)日：2019-12-26

申请号：US16268385

申请日：2019-02-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH ,  Yu-Chang CHEN

IPC: H01L23/498 ,  H01L25/16 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package includes a substrate, a first solder paste, an electrical contact and a first encapsulant. The substrate includes a conductive pad. The first solder paste is disposed on the pad. The electrical contact is disposed on the first solder paste. The first encapsulant encapsulates a portion of the electrical contact and exposes the surface of the electrical contact. The electrical contact has a surface facing away from the substrate. A melting point of the electrical contact is greater than that of the first solder paste. The first encapsulant includes a first surface facing toward the substrate and a second surface opposite to the first surface. The second surface of the first encapsulant is exposed to air.