公开(公告)号：US20190097387A1

公开(公告)日：2019-03-28

申请号：US16118228

申请日：2018-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan TSAI ,  Lu-Ming LAI ,  Ying-Chung CHEN ,  Shih-Chieh TANG

IPC: H01S5/022 ,  H01S5/02 ,  H01L33/62 ,  H01L23/00 ,  H01L23/538 ,  H01L25/075 ,  H01S5/40 ,  H01L33/48

Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.