公开(公告)号：US20180072563A1

公开(公告)日：2018-03-15

申请号：US15815432

申请日：2017-11-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han HUANG ,  Hsun-Wei CHAN ,  Yu-Hsuan TSAI

IPC: B81B7/00 ,  H01L31/0203 ,  B81C1/00

Abstract: A semiconductor device package includes: (1) a carrier; (2) a sensor element disposed on or within the carrier; and (3) a cover including a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface, and the penetrating hole exposing the sensor element. The semiconductor device package is characterized such that (i) the inner sidewall is divided into an upper portion and a lower portion, the upper portion is substantially perpendicular to the top surface, and the lower portion is tilted; or (ii) the entire inner sidewall is tilted. The lower portion of the inner sidewall or the entire inner sidewall is tilted at an angle of between about 10° to less than about 90°, relative to the top surface.

公开(公告)号：US20180068962A1

公开(公告)日：2018-03-08

申请号：US15649474

申请日：2017-07-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuang-Hsiung CHEN ,  Yu-Hsuan TSAI ,  Yu-Ying LEE ,  Sheng-Ming WANG ,  Wun-Jheng SYU

IPC: H01L23/00 ,  B81B7/00 ,  B81C1/00 ,  H01L25/00 ,  H01L25/065 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/02 ,  B81B7/0006 ,  B81B2207/012 ,  B81C1/0023 ,  B81C1/00333 ,  B81C2203/0792 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02373 ,  H01L2224/11462 ,  H01L2224/13018

Abstract: In one or more embodiments, a micro-electromechanical systems (MEMS) package structure comprises a MEMS die, a conductive pillar adjacent to the MEMS die, a package body and a binding layer on the package body. The package body encapsulates the MEMS die and the conductive pillar, and exposes a top surface of the conductive pillar. A glass transition temperature (Tg) of the package body is greater than a temperature for forming the binding layer (Tc).

公开(公告)号：US20190267298A1

公开(公告)日：2019-08-29

申请号：US16282147

申请日：2019-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin Lin WU ,  Yu-Hsuan TSAI ,  Chang Chin TSAI ,  Lu-Ming LAI ,  Ching-Han HUANG

IPC: H01L23/20 ,  H01L23/043 ,  H01L23/053 ,  H01L23/10 ,  H01L23/26 ,  H01L21/48

Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.

公开(公告)号：US20170113922A1

公开(公告)日：2017-04-27

申请号：US14923602

申请日：2015-10-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han HUANG ,  Hsun-Wei CHAN ,  Yu-Hsuan TSAI

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0067 ,  B81B2201/0292 ,  B81C1/00317 ,  B81C2203/0109 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A semiconductor device package includes a carrier, a sensor element disposed on or within the carrier, a cover and a filter. The cover includes a base substrate and a periphery barrier. The base substrate includes an inner sidewall. The inner sidewall of the base substrate defines a penetrating hole extending from a top surface of the base substrate to a bottom surface of the base substrate; at least a portion of the inner sidewall of the base substrate is tilted. The periphery barrier is coupled to the bottom surface of the base substrate and contacts a top surface of the carrier. The filter is disposed on the top surface of the base substrate and covers the penetrating hole.

公开(公告)号：US20210206628A1

公开(公告)日：2021-07-08

申请号：US16734060

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan TSAI ,  Lu-Ming LAI ,  Chien-Wei FANG ,  Ching-Han HUANG

IPC: B81B7/00 ,  B81C1/00

Abstract: A semiconductor package structure includes a die paddle, a plurality of leads, an electronic component and a package body. Each of the plurality of leads is separated from the die paddle and has an inner side surface facing the die paddle. The electronic component is disposed on the die paddle. The package body covers the die paddle, the plurality of leads and the electronic component. The package body is in direct contact with a bottom surface of the die paddle and the inner side surface of the plurality of leads.

公开(公告)号：US20200002162A1

公开(公告)日：2020-01-02

申请号：US16452370

申请日：2019-06-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Yu-Hsuan TSAI ,  Yin-Hao CHEN ,  Hsin Lin WU ,  San-Kuei YU

IPC: B81C1/00 ,  H01L23/498 ,  H01L23/00 ,  B81B7/00

Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.

公开(公告)号：US20180265347A1

公开(公告)日：2018-09-20

申请号：US15921265

申请日：2018-03-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming Yen LEE ,  Chia Hao SUNG ,  Ching-Han HUANG ,  Yu-Hsuan TSAI

IPC: B81B3/00 ,  B81C1/00

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

公开(公告)号：US20170141257A1

公开(公告)日：2017-05-18

申请号：US14941069

申请日：2015-11-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan TSAI ,  Lu-Ming LAI

IPC: H01L31/173 ,  H01L33/58 ,  H01L33/48 ,  H01L31/18

CPC classification number: H01L31/173 ,  H01L25/167

Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.

公开(公告)号：US20200283288A1

公开(公告)日：2020-09-10

申请号：US16885150

申请日：2020-05-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming Yen LEE ,  Chia-Hao SUNG ,  Ching-Han HUANG ,  Yu-Hsuan TSAI

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00 ,  H01L23/538 ,  H01L23/48 ,  H01L23/522 ,  H01L23/52 ,  H01L23/525 ,  H01L21/66 ,  B81C3/00 ,  H01L23/31 ,  H01L23/13 ,  H01L23/12 ,  H01L23/28

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

公开(公告)号：US20190198469A1

公开(公告)日：2019-06-27

申请号：US16293606

申请日：2019-03-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuang-Hsiung CHEN ,  Yu-Hsuan TSAI ,  Yu-Ying LEE ,  Sheng-Ming WANG ,  Wun-Jheng SYU

IPC: H01L23/00 ,  B81C1/00 ,  H01L25/00 ,  H01L25/065 ,  B81B7/00 ,  H01L21/56 ,  H01L23/31

Abstract: A micro-electromechanical systems (MEMS) package structure includes: (1) a circuit layer; (2) a MEMS die with an active surface, wherein the active surface faces the circuit layer; (3) a conductive pillar adjacent to the MEMS die; and (4) a package body encapsulating the MEMS die and the conductive pillar, and exposing a top surface of the conductive pillar.