Magnetic Field Sensor Integrated Circuit with an Integrated Coil

    公开(公告)号:US20210111284A1

    公开(公告)日:2021-04-15

    申请号:US17130085

    申请日:2020-12-22

    Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.

    Magnetic Field Sensor Integrated Circuit With Integral Ferromagnetic Material

    公开(公告)号:US20190157465A1

    公开(公告)日:2019-05-23

    申请号:US16252789

    申请日:2019-01-21

    Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.

    Methods and apparatus for monitoring a level of a regulated source

    公开(公告)号:US10209279B2

    公开(公告)日:2019-02-19

    申请号:US14748692

    申请日:2015-06-24

    Abstract: A monitor circuit for monitoring a level of a first and second regulated source may monitor a voltage level of regulated voltages or a current level of regulated currents. In an embodiment, the monitor circuit includes circuitry responsive to a first regulated voltage and to a second regulated voltage. A first circuit responsive to the first regulated voltage and to the second regulated voltage generates a first error signal indicative of at least one of an overvoltage condition of the first regulated voltage and an undervoltage condition of the second regulated voltage. A second circuit responsive to the first regulated voltage and to the second regulated voltage generates a second error signal indicative of at least one of an undervoltage condition of the first regulated voltage and an overvoltage condition of the second regulated voltage. A method for monitoring the levels of first and second regulated sources is also provided.

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