Abstract:
A front end module includes an antenna path and a diplexer that is connected to the antenna path, to a first signal path, to a second signal path, and to a third signal path. The first signal path is for transmitting transceiver signals in at least two first frequency bands that are assigned to different transmission systems. The second signal path is for transmitting transceiver signals in at least two second frequency bands that are assigned to different transmission systems. The third signal path is for transmitting reception signals in a third frequency band.
Abstract:
A network for electrical matching of an electrical component is disclosed. The network includes n first conductor plane and a second conductor plane separated by a ceramic intermediate layer. The network also includes a transformation line formed in or on a substrate and having a predetermined electrical length. The transformation line includes a first part having a bent-over configuration and a second part having a bent-over configuration. The first part is disposed in a first plane and the second part is disposed in a second plane. The second part is electrically connected to the first part by an interlayer contact to the ceramic intermediate layer.
Abstract:
A circuit arrangement for a mobile radio device includes a first transmission path for a first communication system with TDD duplex operation and a second transmission path for a second communication system with FDD duplex operation. The first transmission path contains a first transmission filter and the second transmission path contains a first duplexer. The first and second communication systems use transmission frequency bands that are arranged within the same octave. A transmitted signal from the first communication system can be routed switchably and thus either via the first or the second transmission path.
Abstract:
A band-stop filter is proposed which is constructed on a multilayered substrate and consists of a parallel circuit comprising a bandpass filter and a high-pass filter. The two filters are at least partly realized in the form of LC-elements integrated into the substrate. Further circuit components can be arranged as discrete components on the substrate. In the filter branch having the bandpass filter, an electroacoustic resonator is arranged in a transverse branch to ground. By means of the filter, a wide stop band is obtained, while the passband or passbands can comprise a plurality of radio bands.
Abstract:
Circuitry includes a terminal for a high-frequency signal, at least two signal lines, a switching unit for connecting the terminal to a signal line, and a primary protection device for protecting against electrostatic discharges. The primary protection device is between the terminal and the switching unit. The primary protection device includes a first element that diverts voltages having a pulse height greater than 200V relative to a reference potential.
Abstract:
A band-stop filter is proposed which is constructed on a multilayered substrate and consists of a parallel circuit comprising a bandpass filter and a high-pass filter. The two filters are at least partly realized in the form of LC-elements integrated into the substrate. Further circuit components can be arranged as discrete components on the substrate. In the filter branch having the bandpass filter, an electroacoustic resonator is arranged in a transverse branch to ground. By means of the filter, a wide stop band is obtained, while the passband or passbands can comprise a plurality of radio bands.
Abstract:
The invention relates to an electrical circuit that includes a first signal path having differential partial paths. An interface circuit arranged in the first signal path suppresses the common-mode signals in a blocking region of the signal path, but essentially does not influence differential signal parts.
Abstract:
An electrical component is described with a first signal path (TX, RX1) and a second signal path (RX, RX2) that are connected to a common signal path (ANT, RX12). In the first signal path a first filter (F1) is arranged, and in the second signal path a second filter (F2) is arranged. The component comprises a first matching circuit (MA1) that comprises a shunt arm to ground. In the shunt arm, an inductor (L) is arranged, which is connected to the first signal path, the second signal path, and the common signal path. The component comprises a carrier substrate (SU) on which the filters (F1, F2), which are preferably implemented as chips, are mounted. The inductor (L) is integrated in the carrier substrate (SU).