公开(公告)号：US07735216B2

公开(公告)日：2010-06-15

申请号：US10597012

申请日：2004-01-15

申请人： Christopher M. Schnabel ,  Peter A. Smith ,  John E. Florkey ,  Richard P. Volant

发明人： Christopher M. Schnabel ,  Peter A. Smith ,  John E. Florkey ,  Richard P. Volant

IPC分类号： B23P19/00 ,  H05K3/30

CPC分类号： B81C3/002 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187

摘要： Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appropriate location and released so as to fall into position as needed. The assembly area (100) includes a cavity below the plane of the carriers such that the parts held within the carrier drop into the cavity. Heating elements are integrated into the cavity to assist in the release of the parts. The cavity is supplied with parts by one or more carriers which are move around by any number of MEMS drive systems (200, 250). The cavity and some of the MEMS assembled therein deliver with precision amounts of materials as required suitable for biomedical applications, or may be processed in-situ, as in an on-chip laboratory.

摘要翻译： 用于组装复杂MEMS器件的载体（10）保持部件（50）被运输到中心组装位置。 这些部件以预先分配的顺序堆叠，然后从其运营商释放。 或者，它们被定位在适当的位置上并被释放以便根据需要落入位置。 组装区域（100）包括在载体平面下方的空腔，使得保持在载体内的部分落入空腔内。 加热元件集成到腔体中以帮助部件的释放。 空腔由一个或多个载体提供，该载体通过任何数量的MEMS驱动系统（200,250）移动。 组装在其中的腔和一些MEMS提供精确量的材料，适合于生物医学应用，或者可以像在片上实验室一样原位加工。

公开(公告)号：US20090007051A1

公开(公告)日：2009-01-01

申请号：US11770303

申请日：2007-06-28

申请人： Anthony I. Chou ,  James S. Dunn ,  Brian M. Dufrene ,  Christopher H. Lumbra ,  Shreesh Narasimha ,  Christopher S. Putnam ,  BethAnn Rainey ,  Christopher M. Schnabel

发明人： Anthony I. Chou ,  James S. Dunn ,  Brian M. Dufrene ,  Christopher H. Lumbra ,  Shreesh Narasimha ,  Christopher S. Putnam ,  BethAnn Rainey ,  Christopher M. Schnabel

IPC分类号： G06F17/50

CPC分类号： G06F17/5068 ,  G06F2217/14 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system, method and program product that allows multiple devices to be placed between pads such that a Back End Of Line (BEOL) mask change can be used to select different device options. A system is disclosed for implementing a testsite for characterizing devices in an integrated circuit technology, and includes: a system for designing a plurality of device options for a set of chip pads; a system for designing a pseudo wiring layout for each of the plurality of device options; a system for selecting one of the device options; a system for mapping the pseudo wiring layout for a selected device option to a predetermined design level; and a system for outputting a configured mask design at the predetermined design level having a wiring layout mapped for the selected device option.

摘要翻译： 一种允许多个设备放置在焊盘之间的系统，方法和程序产品，使得后端（BEOL）掩模更改可用于选择不同的设备选项。 公开了一种用于实现用于表征集成电路技术中的器件的测试现场的系统，并且包括：用于为一组芯片焊盘设计多个器件选项的系统; 用于为所述多个设备选项中的每一个设计伪布线布局的系统; 用于选择所述设备选项之一的系统; 用于将所选择的设备选项的伪布线布局映射到预定设计级的系统; 以及用于在具有针对所选择的设备选项映射的布线布局的预定设计级别处输出配置的掩模设计的系统。

公开(公告)号：US06861186B1

公开(公告)日：2005-03-01

申请号：US10605368

申请日：2003-09-25

申请人： Francois Pagette ,  Christopher M. Schnabel

发明人： Francois Pagette ,  Christopher M. Schnabel

IPC分类号： G01B11/00 ,  G03F7/20 ,  G03F9/00

CPC分类号： G03F7/70425 ,  G03F9/7003 ,  G03F9/7084

摘要： An image of an integrated circuit chip and optical kerf and their mirror image are formed within a single optical field. When a substrate pattern using this process is flipped over or reversed, the processed pattern appears the same as on the first side, equal to its own mirror image. Prior to the backside lithography, a portion of the second side is removed to allow detection of alignment marks on the first side from the second side of the substrate. Once the alignment marks are detected, the lithography continues as though the substrate was not flipped over at all.

摘要翻译： 在单个光场内形成集成电路芯片和光学切口及其镜像的图像。 当使用该处理的基板图案被翻转或反转时，处理图案显示与第一侧相同，等于其自己的镜像。 在背面光刻之前，去除第二侧的一部分以允许从衬底的第二侧检测第一侧上的对准标记。 一旦检测到对准标记，就像基片完全没有翻转一样，光刻继续。