公开(公告)号：US20140264904A1

公开(公告)日：2014-09-18

申请号：US13801104

申请日：2013-03-13

Applicant: Apple Inc.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L23/498 ,  H01L21/50

CPC classification number: H01L23/49827 ,  H01L23/5384 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0268 ,  H05K1/181 ,  H05K3/282 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2201/10553 ,  Y02P70/611 ,  H01L2924/00

Abstract: Memory systems and methods for creating the same are disclosed. The memory systems can include pairs of IC packages mounted on either side of a system substrate. Contacts formed on the IC packages can be communicatively coupled with contacts of a paired IC package using vias that extend through the system substrate. The IC packages can further communicate with a controller mounted on one side of the system substrate using the vias as well as conductive traces formed in the system substrate.

Abstract translation: 公开了用于创建其的存储器系统和方法。 存储器系统可以包括安装在系统基板两侧的IC封装对。 形成在IC封装上的触点可以通过使用延伸穿过系统基板的通孔与成对IC封装的触点通信耦合。 IC封装可以使用通孔以及形成在系统基板中的导电迹线进一步与安装在系统基板一侧的控制器进行通信。