公开(公告)号：US09679187B2

公开(公告)日：2017-06-13

申请号：US14741831

申请日：2015-06-17

Applicant: Apple Inc.

Inventor： Milind S. Bhagavat ,  Patrick E. O'Brien ,  Jun Zhai ,  Dale R. Setlak ,  David D. Coons ,  Kwan-Yu Lai

IPC: G06K9/00

CPC classification number: G06K9/00053

Abstract: A finger biometric sensor assembly may include a finger biometric sensor integrated circuit (IC) die having a finger sensing area and a cover layer aligned with the finger sensing area. The finger biometric sensor may also include a direct bonding interface between the finger biometric sensor and the cover layer.

公开(公告)号：US20140361395A1

公开(公告)日：2014-12-11

申请号：US14294903

申请日：2014-06-03

Applicant: Apple Inc.

Inventor： Milind S. Bhagavat ,  Jun Zhai

IPC: H01L27/146 ,  G06K9/00

CPC classification number: G06K9/0002 ,  H01L27/14634 ,  H01L27/14636

Abstract: A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.

Abstract translation: 传感器包括形成在基板的第一侧上的传感器阵列和至少一个可操作地与形成在基板的第二侧上的传感器阵列通信的电路。 至少一个通孔延伸穿过衬底以将传感器阵列电连接到至少一个电路。 将至少一个电路放置在基板的第二侧上，使得传感器阵列基本上占据基板的所有第一侧。

公开(公告)号：US11002572B2

公开(公告)日：2021-05-11

申请号：US16872600

申请日：2020-05-12

Applicant: Apple Inc.

Inventor： Paisith P. Boonsom ,  Serhan O. Isikman ,  Richard Ruh ,  Prashanth S. Holenarsipur ,  Colin M. Ely ,  William N. Pickeral ,  Jairam Manjunathaiah ,  David G. Havskjold ,  Anant Rai ,  Maegan K. Spencer ,  Milind S. Bhagavat

IPC: G01D5/347 ,  G01D5/30

Abstract: Embodiments of the present disclosure provide an optical encoder for an electronic device. The optical encoder includes a spindle and an encoded pattern disposed around a circumference of the spindle. The encoded pattern may include one or more surface features that create a direction-dependent reflective region.

公开(公告)号：US20190017846A1

公开(公告)日：2019-01-17

申请号：US16134888

申请日：2018-09-18

Applicant: Apple Inc,

Inventor： Paisith P. Boonsom ,  Serhan O. Isikman ,  Richard Ruh ,  Prashanth S. Holenarsipur ,  Colin M. Ely ,  William N. Pickeral ,  Jairam Manjunathaiah ,  David G. Havskjold ,  Anant Rai ,  Maegan K. Spencer ,  Milind S. Bhagavat

IPC: G01D5/347

Abstract: Embodiments of the present disclosure provide an optical encoder for an electronic device. The optical encoder includes a spindle and an encoded pattern disposed around a circumference of the spindle. The encoded pattern may include one or more surface features that create a direction-dependent reflective region.

公开(公告)号：US10145711B2

公开(公告)日：2018-12-04

申请号：US15060069

申请日：2016-03-03

Applicant: Apple Inc.

Inventor： Paisith P. Boonsom ,  Serhan O. Isikman ,  Richard Ruh ,  Prashanth S. Holenarsipur ,  Colin M. Ely ,  William N. Pickeral ,  Jairam Manjunathaiah ,  David G. Havskjold ,  Anant Rai ,  Maegan K. Spencer ,  Milind S. Bhagavat

IPC: G01D5/347

Abstract: Embodiments of the present disclosure provide an optical encoder for an electronic device. The optical encoder includes a spindle and an encoded pattern disposed around a circumference of the spindle. The encoded pattern may include one or more surface features that create a direction-dependent reflective region.

公开(公告)号：US09850127B1

公开(公告)日：2017-12-26

申请号：US15669231

申请日：2017-08-04

Applicant: Apple Inc.

Inventor： Milind S. Bhagavat ,  Richard Yeh ,  Henry H. Yang

IPC: H01L21/00 ,  B81C1/00

CPC classification number: B81C1/00825 ,  B81B2203/0118 ,  B81B2207/115

Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

公开(公告)号：US20160371529A1

公开(公告)日：2016-12-22

申请号：US14741831

申请日：2015-06-17

Applicant: Apple Inc.

Inventor： Milind S. Bhagavat ,  Patrick E. O'Brien ,  Jun Zhai ,  Dale R. Setlak ,  David D. Coons ,  Kwan-Yu Lai

IPC: G06K9/00

CPC classification number: G06K9/00053

Abstract: A finger biometric sensor assembly may include a finger biometric sensor integrated circuit (IC) die having a finger sensing area and a cover layer aligned with the finger sensing area. The finger biometric sensor may also include a direct bonding interface between the finger biometric sensor and the cover layer.

Abstract translation: 手指生物测定传感器组件可以包括具有手指感测区域和与手指感测区域对准的覆盖层的手指生物测定传感器集成电路（IC）裸片。 手指生物测定传感器还可以包括手指生物测定传感器和覆盖层之间的直接接合界面。