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    Flexible temperature sensing devices for body temperature sensing
    11.
    发明授权
    Flexible temperature sensing devices for body temperature sensing 有权

    公开(公告)号：US11771329B2

    公开(公告)日：2023-10-03

    申请号：US17031559

    申请日：2020-09-24

    Applicant: Apple Inc.

    Inventor： Paul Mansky ,  Xiaofan Niu ,  James C. Clements ,  Mahmut Tosun ,  Michael Vosgueritchian

    IPC: A61B5/01 ,  A61B5/00 ,  G01K13/20

    CPC classification number: A61B5/01 ,  A61B5/6892 ,  G01K13/20 ,  A61B2562/0271 ,  A61B2562/043

    Abstract: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.

    Electronic Devices Having Quantum Film Infrared Sensors
    15.
    发明申请
    Electronic Devices Having Quantum Film Infrared Sensors 有权

    公开(公告)号：US20230087411A1

    公开(公告)日：2023-03-23

    申请号：US17483660

    申请日：2021-09-23

    Applicant: Apple Inc.

    Inventor： Xiaofan Niu ,  Tong Chen ,  Mark T. Winkler ,  Zachary M. Beiley ,  Andras G. Pattantyus-Abraham

    IPC: H01L25/16

    Abstract: An electronic device may include an infrared sensor with light sources and a quantum film photodetector. The light sources may emit short-wavelength infrared (SWIR) light through a display panel and the photodetector may receive the SWIR light through the panel after reflection off an object. The light sources and an integrated circuit may be mounted to a wall of a sensor module mounted to the panel. The module may include a lens. The photodetector may be disposed onto the rear wall, lens, integrated circuit, or display panel. The photodetector may include multiple types of quantum film to absorb different wavelengths of SWIR light. The SWIR light may pass through the display panel without distorting images emitted by the display panel. Using a quantum film in the photodetector may allow the photodetector to extend across a large surface area without unnecessarily increasing manufacturing cost for the device.

    Dual resistive strain and pressure sensor for force touch
    17.
    发明授权
    Dual resistive strain and pressure sensor for force touch 有权

    公开(公告)号：US10353506B2

    公开(公告)日：2019-07-16

    申请号：US15625952

    申请日：2017-06-16

    Applicant: Apple Inc.

    Inventor： Michael Vosgueritchian ,  Sinan Filiz ,  James E. Pedder ,  John Stephen Smith ,  Saahil Mehra ,  Xiaofan Niu

    IPC: G06F3/041 ,  G06F3/044

    Abstract: Structures and methods are disclosed for an electronic device having an input surface that uses dual sensors to measure forces applied to the input surface. The forces can be estimated over a greater range of values than would be possible with either sensor alone. A second sensor can be used after a first sensor has reached a limit. A first sensor can be a strain sensor and a second sensor a pressure sensor. Both sensors may be resistance based, with signals from both sensors can be combined and measured by processing circuitry. Each sensor type may be part of planar arrays disposed beneath the input surface.

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