Electronic devices with sheet-packed coherent fiber bundles

    公开(公告)号:US11500228B1

    公开(公告)日:2022-11-15

    申请号:US17156139

    申请日:2021-01-22

    申请人: Apple Inc.

    摘要: An electronic device may have a display, a display cover layer, and a sheet-packed coherent fiber bundle. The coherent fiber bundle may have an input surface that receives an image from the display and a corresponding output surface to which the image is transported. The coherent fiber bundle may be placed between the display and the display cover layer and mounted to a housing. The coherent fiber bundle may have fiber cores with bends that help conceal the housing from view and make the display appear borderless. The coherent fiber bundle has filaments formed from elongated strands of binder in which multiple fiber cores are embedded. Sheets of filaments are stacked and fused together to form the coherent fiber bundle. By aligning and fusing the sheets with respect to each other the filaments are packed with a desired density and uniformity.

    Conductive adhesive film structures

    公开(公告)号:US10224304B2

    公开(公告)日:2019-03-05

    申请号:US15421194

    申请日:2017-01-31

    申请人: Apple Inc.

    摘要: Conductive adhesive films can include a binding material having a first set of conductive particles therewithin. The binding material can be electrically non-conductive and can flow between and bond external electronic components during a bonding process. The first set of conductive particles can each have cores formed of a first material, such as polymer, and coatings surrounding the cores, the coatings formed of a second material that is electrically conductive, such as nickel. The binding material can also include a second set of smaller conductive particles formed of a third material that is electrically conductive, such as copper, which can have coatings formed of a fourth material that is electrically conductive, such as silver. The first set of conductive particles can each be sphere shaped, and the second set of conductive particles can each be flake shaped. The conductive particles can form electrical paths between the external electronic components.

    Reinforcement components for electrical connections with limited accessibility and systems and methods for making the same

    公开(公告)号:US10098224B1

    公开(公告)日:2018-10-09

    申请号:US15871585

    申请日:2018-01-15

    申请人: Apple Inc.

    摘要: Reinforcement components for electrical connections with limited accessibility Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same are provided. In some embodiments, a reinforcement component may be compressed between two portions of a first electronic component in order to deform the reinforcement component for filling in a void between the reinforcement component and a coupling formed between the first electronic component and a second electronic component. The first electronic component may be a flexible circuit component that may be folded over the reinforcement component prior to the reinforcement component being compressed. This may enable the reinforcement component to be effectively positioned with respect to the first electronic component prior to being deformed for reinforcing one or more couplings made between the first electronic component and the second electronic component.

    Display Backlights with Reduced Mixing Distances

    公开(公告)号:US20170371086A1

    公开(公告)日:2017-12-28

    申请号:US15260993

    申请日:2016-09-09

    申请人: Apple Inc.

    IPC分类号: F21V8/00

    摘要: A display may have a backlight with a row of light-emitting diodes that emit light into an edge surface of a light guide layer. The light guide layer may have opposing planar surfaces. Light-scattering structures such as light-scattering holes that extend between the planar surfaces may be used to scatter rays of light by refraction and/or diffraction and can thereby homogenize light from the light-emitting diodes. The homogenized light may then be extracted from the light guide layer and may serve as backlight illumination for an array of pixels such as an array of liquid crystal display pixels. Light-scattering structures such as grooves, pits, bumps, and other structures for scattering light from the light-emitting diodes may be formed on the edge surface of the light guide layer to enhance light mixing.

    Electronic devices with coherent fiber bundles

    公开(公告)号:US11754779B1

    公开(公告)日:2023-09-12

    申请号:US17376460

    申请日:2021-07-15

    申请人: Apple Inc.

    IPC分类号: G02B6/06

    CPC分类号: G02B6/06

    摘要: An electronic device may have a display, a display cover layer, and an image transport layer formed from a coherent fiber bundle. The coherent fiber bundle may have an input surface that receives an image from the display and a corresponding output surface to which the image is provide through the coherent fiber bundle. The coherent fiber bundle may be placed between the display and the display cover layer and mounted to a housing. The coherent fiber bundle may have fiber cores with bends that help conceal the housing from view and make the display appear borderless. A central portion of the coherent fiber bundle may be formed from different materials and/or structures than a surrounding border portion of the layer.

    Load Cell Array for Detection of Force Input to an Electronic Device Enclosure

    公开(公告)号:US20210004115A1

    公开(公告)日:2021-01-07

    申请号:US17027296

    申请日:2020-09-21

    申请人: Apple Inc.

    IPC分类号: G06F3/041 G06F1/16

    摘要: A force input sensor includes a load cell to adapt a compressive force applied to the force input sensor into a strain experienced by a strain sensor in the load cell. In particular, the load cell includes two compression plates separated from one another by a gap so as to define a volume between them. A flexible substrate (a “diaphragm”)—includes a strain sensor and is disposed and supported within the volume. One of the two compression plates includes a feature (a “loading feature”) that extends toward a central region of the flexible substrate. As a result of this construction, when the compression plates receive a compressive force, the loading feature induces a bending moment in the flexible substrate, thereby straining the strain sensor.

    Load Cell Array for Detection of Force Input to an Electronic Device Enclosure

    公开(公告)号:US20200073504A1

    公开(公告)日:2020-03-05

    申请号:US16116785

    申请日:2018-08-29

    申请人: Apple Inc.

    IPC分类号: G06F3/041 G06F1/16

    摘要: A force input sensor includes a load cell to adapt a compressive force applied to the force input sensor into a strain experienced by a strain sensor in the load cell. In particular, the load cell includes two compression plates separated from one another by a gap so as to define a volume between them. A flexible substrate (a “diaphragm”)—includes a strain sensor and is disposed and supported within the volume. One of the two compression plates includes a feature (a “loading feature”) that extends toward a central region of the flexible substrate. As a result of this construction, when the compression plates receive a compressive force, the loading feature induces a bending moment in the flexible substrate, thereby straining the strain sensor.