公开(公告)号：US20240407199A1

公开(公告)日：2024-12-05

申请号：US18661371

申请日：2024-05-10

Applicant: Applied Materials, Inc.

Inventor： Jong Yun KIM ,  Ji Young CHOUNG ,  Kim Seong SIM ,  Yu-Hsin LIN

IPC: H10K59/122 ,  H10K59/12 ,  H10K71/16

Abstract: Embodiments of the present disclosure provide methods for forming sub circuits (e.g., sub-pixel circuits). One example sub circuit generally includes a backplane layer disposed over a substrate, a pixel defining layer (PDL) disposed over the backplane layer, the PDL exposing anodes disposed over the backplane layer and the substrate, and a plurality of walls disposed over the PDL, wherein the plurality of walls define a plurality of gaps, wherein the plurality of walls and the plurality of gaps define one or more unit pixels, and wherein the one or more unit pixels each comprise a sub-pixel. Each sub-pixel may include an anode defined by the PDL, an organic light-emitting diode (OLED) material disposed over the anode, and a cathode disposed over the OLED material and the plurality of walls.