公开(公告)号：US20240341127A1

公开(公告)日：2024-10-10

申请号：US18746413

申请日：2024-06-18

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-Hsin LIN

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/80521

Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US20250169326A1

公开(公告)日：2025-05-22

申请号：US18949389

申请日：2024-11-15

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Jungmin LEE ,  Yu-Hsin LIN ,  Ji Young CHOUNG ,  Wen-Hao WU

IPC: H10K59/60 ,  H10K59/12 ,  H10K59/70 ,  H10K65/00 ,  H10K102/10

Abstract: Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein include a backplane and a plurality of sub-pixel circuits separated by adjacent overhang structures disposed over the backplane. The at least one sub-pixel circuit has sub-pixels surrounded by adjacent overhang structures. The sub-pixel circuit includes one or more organic light-emitting diode (OLED) sub-pixels and an organic photodiode (OPD) sub-pixel. The OLED sub-pixels include a transistor disposed in the backplane, an electrode disposed over the transistor, an OLED material disposed over the electrode. The electrode is connected to the transistor of the backplane. The OPD sub-pixel includes an electrode and an organic photodiode (OPD) material disposed over the electrode.

公开(公告)号：US20250107353A1

公开(公告)日：2025-03-27

申请号：US18977548

申请日：2024-12-11

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-Hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

公开(公告)号：US20240147825A1

公开(公告)日：2024-05-02

申请号：US17974385

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Yu-Hsin LIN ,  Ji Young CHOUNG ,  Jungmin LEE ,  Wen-Hao WU ,  Dieter HAAS

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/52

CPC classification number: H01L51/56 ,  H01L27/3246 ,  H01L51/5253 ,  H01L2227/323 ,  H01L2251/5315

Abstract: Examples disclosed herein relate to device. The device includes a substrate, a plurality of adjacent pixel-defining layer (PDL structures disposed over the substrate, and a plurality of sub-pixels. The PDL structure have a top surface coupled to adjacent sidewalls of the PDL structure. The plurality of sub-pixels are defined by the PDL structures. Each sub-pixel includes an anode, an organic light emitting diode (OLED), a cathode, and an encapsulation layer. The organic light emitting diode (OLED) material disposed over the anode. The OLED material extends over the top surface of the PDL structure past the adjacent sidewalls. The cathode is disposed over the OLED material. The cathode extends over the top surface of the PDL structure past the adjacent sidewalls. The encapsulation layer is disposed over the cathode. The encapsulation layer has a first sidewall and a second sidewall.

公开(公告)号：US20250048844A1

公开(公告)日：2025-02-06

申请号：US18771267

申请日：2024-07-12

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Dieter HAAS ,  Yu-Hsin LIN ,  Chung-chia CHEN ,  Ji Young CHOUNG

IPC: H10K59/122 ,  H10K59/12

Abstract: Embodiments described herein relate to a method of forming a sub-pixel. The method includes depositing a first structure material over a substrate and an anode. The anode is disposed over the substrate. An interlayer dielectric (ILD) material is deposited over the first structure material. An ILD material is patterned. An intermediate structure material is deposited over the ILD material and the first structure material. A second structure material is deposited over the intermediate structure material. A portion of the second structure material is removed to form a second structure. A portion of the intermediate structure material disposed over the ILD material is removed to form an intermediate structure. A portion of the first structure material is removed to form a first structure of an overhang structure. The overhang structure comprises the first structure, the second structure, and the intermediate structure.

公开(公告)号：US20250008823A1

公开(公告)日：2025-01-02

申请号：US18594527

申请日：2024-03-04

Applicant: Applied Materials, Inc.

Inventor： Zongkai WU ,  Pei Chia CHEN ,  Wen-Hao WU ,  Jungmin LEE ,  Chung-chia CHEN ,  Yu-Hsin LIN ,  Kevin CHEN ,  Wenhui LI ,  Yu-Min WANG ,  Lai ZHAO ,  Soo Young CHOI

IPC: H10K59/80 ,  H10K59/12 ,  H10K59/122

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display, such as an organic light-emitting diode (OLED) display, are provided. In one example, a sub-pixel includes a substrate, adjacent overhang structures, an anode, an OLED material, a cathode, an encapsulation layer stack. The encapsulation layer stack includes a first layer, a second layer disposed over the first layer, and a third layer. The first layer and the second layer have a first portion disposed over the cathode, a second portion disposed over a sidewall of each overhang structure, and a third portion disposed under an underside surface of an extension of each overhang structure. A gap is defined by contact of the first portion of the second layer and the third portion of the second layer. The third layer is disposed over the second layer outside of the gap.

公开(公告)号：US20240357873A1

公开(公告)日：2024-10-24

申请号：US18639882

申请日：2024-04-18

Applicant: Applied Materials, Inc.

Inventor： Yu-Hsin LIN ,  Chung-Chia CHEN ,  Takuji KATO ,  Ji Young CHOUNG

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K59/80521

Abstract: Embodiments described herein relate to sub-pixel circuits and for a display such as an organic light-emitting diode (OLED) display. In one embodiment, a device is provided. The device includes a substrate, two external pixel-defining layer (PDL) structures disposed over the substrate, an overhang opening defined by a top extensions of top structures disposed on and extending laterally past body structures, each body structure disposed over an upper surface of each external PDL structure, the overhang openings defining at least two sub-pixels including a first sub-pixel and a second sub-pixel, and at least one internal PDL structure disposed over the substrate, wherein the first sub-pixel and the second sub-pixel are connected over a top surface of the internal PDL structure with a first organic light-emitting diode (OLED) material of the first sub-pixel connecting a second OLED material of the second sub-pixel on the top surface of the internal PDL structure.

公开(公告)号：US20240315086A1

公开(公告)日：2024-09-19

申请号：US18601566

申请日：2024-03-11

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-Hsin LIN ,  Jungmin LEE

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/873

Abstract: Embodiments described herein generally relate to a device. The device includes a substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent overhangs disposed over the substrate. Each overhang includes two or more overhang structures, an organic light emitting diode (OLED) material, and a cathode. The overhang structures include a first overhang defined by a first overhang structure outer extension of a second structure extending laterally past a first structure. The first structure is disposed over the substrate. The second structure is disposed over the first structure. The second structure of a first overhang structure is separated from the second structure of a second overhang structure by a structure gap. The OLED material is disposed over an anode. The cathode is disposed over the OLED material.

公开(公告)号：US20230263012A1

公开(公告)日：2023-08-17

申请号：US18139243

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-Hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K59/873

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

公开(公告)号：US20250143089A1

公开(公告)日：2025-05-01

申请号：US18690574

申请日：2023-12-13

Applicant: Applied Materials, Inc.

Inventor： Yu-Hsin LIN ,  Takashi ANJIKI ,  Chung-chia CHEN ,  Jae Wook JEONG ,  Ji Young CHOUNG ,  Jungmin LEE

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80 ,  H10K102/00

Abstract: Embodiments described herein relate to a device. The device includes a substrate, overhang structures disposed over the substrate, and a plurality of sub-pixels. Each overhang structure has a second structure disposed over a first structure. The second structure has an overhang extension extending laterally past the first structure. The first structure includes a first sidewall opposing a second sidewall. The first sidewall and the second sidewall are connected to each other. The plurality of sub-pixels each include an organic light-emitting diode (OLED) material, and a cathode disposed over the OLED material. The cathode extends under the overhang extension such that the cathode contacts the first sidewall and the second sidewall of the first structure under the overhang extension.